The Attractive ID-COOLING ICEKIMO 120W Liquid Cooling System

This time the well-known ID-COOLING company decided to attract customers not with high performance specifications, but with its new liquid cooling system’s original and extraordinary layout.



A heat dissipator, a pump, tubes and a fan with white backlighting are completely WHITE, which evoke associations with ice-cream, ice or snow.


The dimensions of the 14 channel aluminum heatsink are 154 × 120 × 27 mm. FPI number is 20.

An ID-12025M12S fan is of 120 × 120 × 25 standard size. Its max rotary speed is 700–1500 rpm, max air flow ratio is 62.0 cfm, max static pressure is 1.78 mm H2O and the noise level is 18.0–26.4 dBA. The power consumption is announced to be 3.0 W.


The dimensions of the copper microchannel water unit are the following: 68 × 68 × 35.6 mm. It is compatible with Intel LGA115(х)/1366/2011/2011-v3 and AMD Socket AM2(+)/AM3(+)/FM1/ FM12(+) platforms. The cooling agent is nontoxic and anticorrosive.


The total weight of the system makes 639 …

Release of Chassis Aresze Subverter 7650B with Efficient Cooling System

Aresze is going to release its new series of chassis developed in Mid-Tower form factor. Codenamed Subverter 7650B, these chassis are primarily intended at consumers with the heightened demands to the layout and integration but with rather 'modest' financial possibilities. Subverter 7650B series can boast an outstanding efficiency pertained to cooling down. In addition, the internal zoning and integration of this model are similar to that implemented in more costly line of products manufactured by Aresze.



Aresze took all efforts to achieve the maximal results applied to the efficient cooling down. Thus, the framework zoning for the airflow distribution has been designed according to the company's own technology. The bay designated for graphics cards, which can support the cards of up to 300 mm in length, can be applied for the wide range of solutions. The 120 mm fan is located at the top part of the chassis and serve the blowing out means; this way the hot airflow does not …

Processors Intel Haswell to Rival Accelerator NVIDIA Tesla

Intel Corporation has the intentions to introduce DDR4 memory into their server processors of Haswell series. The launch of such technological approach is planned for the 2014, however the developments in this sphere have already started. Intel’s server solutions will become a part of Grantley platform and the samples of their new series will allegedly be announced next autumn. The preview of new processors makes it clear that some of the chips will be distinguished by the increased heat generation performance which will reach 160 W.



Hence, 16-core processors Haswell-EP will rival parallel computing accelerator NVIDIA Tesla but not AMD server solutions. Intel is going to provide various working frequency options and options with different number of active cores. At the same time, TDP will fluctuate within ranges of 160, 145, 135, and 120 W. In its turn, accelerator NVIDIA Tesla, which is based on GK110 processor, consumes approximately 300 W.


In accordance with the …
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Registered at: 25 August 2012, 20:38
Last visit: 26 August 2012, 10:40