Aresze Announces Chassis with Noiseless Cooling System

Enthusiasts and gamers might sigh with relief after their prolonged attempts to find the chassis for the creation of high-performance gaming systems. Aresze is going to release chassis, codenamed Seediq 8003, of new generation which is a perfect match for high-end gaming systems with unique cooling facilities. The chassis is developed in midi-tower form factor and features 520x215x508 mm dimensions. The casing is made of steel alloy, and is ready to accommodate motherboards of micro-ATX and ATX standards.

Despite the average dimensions, Aresze Seediq 8003 is compatible with CPU fans of 175 mm in height, large graphics adapters of up to 300 mm in length with HDD bays and up to 430 mm – without HDD bays, as well as, power supply units of ATX/EPS standard. This chassis has got quite efficient internal layout. Hence, it's equipped with ten sections for drives (four external 5.25 inch drives and six internal 2.5- 3.5 inch drives) and eight PCI slots for four graphics adapters.
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Zalman Unveils Nifty Z9 NEO Chassis

Zalman comes out with a new jaunty PC case – the Z9 NEO. The model is available in two paintwork variations (black and white) and is compatible with mini-iTX, micro-ATX as well as full-format ATX motherboards. The mid-tower chassis features 490x482x205 mm dimensions to fit any environment.

Zalman Z9 NEO is estimated for the installation of 7 expansion cards, a pair of 5.25-inch drives, 4x 3.5-/2.5-inch drives, and two solid-state 2.5-inch drives. The layout provides for the installation of 160-mm high CPU coolers, 420-mm long graphics cards, 220-mm long PSUs (ATX PS/2).

The model allows the user to incorporate an efficient cooling system. Hence, there is room for two front fans (120 mm), two top fans with LED backlit, and one rear fan. The other peculiarities of the chassis are as following:

— the employment of soundproof materials on the front panel;

— the integration of a side acrylic window;

— the availability of swappable air filters on the front …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.

The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
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Registered at: 03 June 2011, 22:16
Last visit: 03 June 2011, 22:16