Ultrabook Lenovo ThinkPad X1 Carbon will debut on August 21

In May this year, Lenovo, HP, along with being the largest manufacturer of branded PCs, has announced plans to release 14-inch ultrabook premium-level ThinkPad X1 Carbon. In order to attract affluent buyers who are in search of a fashion mini-PC, the frame and lid are made of CFRP (carbon fiber) — lightweight and durable material that is used, including in the aerospace industry, and expensive cars. Due to this, the thickness of the laptop is reduced to 17.7 mm, and weights — up to 1.36 kg.



Screen of Lenovo ThinkPad X1 Carbon has a resolution of 1600x900 pixels, a maximum brightness of 300 and wide viewing angles. Graphic system is presented by built Adapter Intel HD 4000 into the processor Ivy Bridge. RAM is 4 GB and can be expanded up to 8 GB. Keyboard ThinkPad Precision doesn’t have numeric keypad, but it has an LED backlight.


In addition, the novelty has a webcam 720p, battery with a resource of battery life of up to 6 h 20 min., fingerprint scanner, connectors …

ECS to Implement AMD Memory Profile Support into Its Motherboards

AMD has won a reputation not only for designing and supplying high-end processors but also for introducing its brand memory expansion, codenamed AMD Memory Profile. This development is called to store and share memory settings profiles and to facilitate the search for the most rational settings. Thus, ECS company is going to implement AMP support for DDR3 memory into its future and current lineup of motherboards. According to the available data, AMP technology will be applied to the upcoming motherboards with AMD processors, and to the current products by means of UEFI firmware update. This is the first 'revival' of the technology since its reconsideration and upgrade.



The integrated technology is destined to setup new frequency, voltage and timings showings which will facilitate in keeping DDR3 memory modules stable. As a rule, random-access memory with high frequencies of more than 2GHz require manual system overclocking. AMP will prevent the emergence of errors while setting …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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