Full-Tower Chassis Fractal Design Arc XL Review

Fractal Design approved itself as a reputable manufacturer of PC chassis long time ago. Nowadays, the company’s inventory embraces four lines of cases, intended for varied customer groups. Curiously enough, Arc series is a twin-brother of Define series in terms of framework, although it is differentiated by an improved ventilation. The Arc XL is a large-scale representative of the line, featuring a sleek design and offering huge integration facilities.

Basic Features

Fractal Design Arc XL is a full-tower chassis featuring 572x232x552 mm dimensions. The case is made of black steel with plastic inclusions. Its internal layout is ready to accommodate all types of motherboards, including the largest formats (XL-ATX, E-ATX, ATX, mini-ITX, micro-ATX). Storage section is rich in four 5.25-inch drive cages (external) and ten 3.5/2.5-inch cages (internal). The availability of nine expansion slots allows for the creation of various graphics and multimedia configurations.

A …

Xigmatek to Release Dark Knight II CPU Cooler

Xigmatek, a multi-profile Taiwanese company, is about to launch its second version of Dark Knight CPU cooler – the SD1483. Featuring 120x50x159 mm dimensions, this tower-like device comes in two color variations: black and white (Frostbourne). The model supports processors with the utmost TDP level of 160 W, designated for AMD AM2/AM3/K8 & Intel LGA 775/1155/1156/2011 platforms.

Xigmatek Dark Knight II SD1483 consists of a small-sized heatsink with fifty-five aluminum thin fins; the latter boasts ceramic coating that is called to enhance heat dissipation area. The heatsink is pierced by three 8 mm heatpipes which support direct contact technology.

The framework also accommodates a single 140 mm fan, based on slide bearing. It is estimated for 150.000 hours of foolproof operation. The integration of PWM technology enables the variation of rotational speed from 800 RPM to 1200 RPM. The blades produce up to 90.3 CFM airflow at the maximum 18 dB noise level. According to the …

Welcome In New LPDDR4 Memory Chips from Samsung

Samsung settles down to a large-scale production of LPDDR4 mobile memory chips. Elaborated according to 20 nm technological norms, the new-comers boast the integration of an advanced technology that ensures 8 Gb crystal density and twice the performance compared with LPDDR3 chips. Currently, the company produces models of 2 GB and 3 GB capacity, however in early 2015 it will set to the development of 4 GB solutions.

New LPDDR4 memory modules are targeting various mobile devices with thirst for lightning-fast data transfer speed. The latter index might accelerate up to 3200 Mb/sec; this will allow employing chips for the implementation of resource-intensive tasks, such as recording and playback of high-resolution video or serial filming.

Samsung developers claim that 2 GB LPDDR4 DRAM is 40% more power-efficient than counterparts with 4 Gb crystal density. This became possible due to the adopting of low-voltage swing-terminated logic for I/O signaling. As a result, the …
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Registered at: 06 December 2011, 10:33
Last visit: 18 October 2012, 16:35