Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …

‘Ice-Cold’ Inno3D iChill GeForce GTX 780 Ti HerculeZ X3 Ultra Review

The newest top GPUs designed by Nvidia and AMD are characterized by higher temperatures and higher noise levels, as compared to the GPUs of the previous generation. That is the price of more power. Nonetheless, average customers cannot be satisfied with efficiency only, so they were patiently waiting for non-reference products with more appropriate cooling. Inno3D always tries its best to comply with the demands of exacting PC enthusiasts, gamers and home users, hence the release of iChill GeForce GTX 780 Ti HerculeZ X3 Ultra graphics cards was much a desire. This model offers an ideal combination of performance along with decreased operational temperatures.

Design and Key Specs

At-a-glance new Inno3D’s creation resembles its predecessors in design matters. This is a voluminous graphics card with bright metallic elements, a three-slot cooler, and three fans with traditional to iChill series ‘snowflake’ stickers. Its side facet houses a dedicated space for iChill …

Lian Li to Release Irregular PC-O5 & PC-O5S Cases

Lian Li Industrial Co. gets ready to start retail sales of two extraordinary PC cases: PC-O5 and PC-O5S. Designed in mini-ITX form-factor, both new-comers boast an open-air design concept where one of the side panels has a totally transparent facet from a hardened glass. The other distinctive feature is an irregular internal layout: the integrated graphics adapter is located in the bottom section and joined with the motherboard by a dedicated card; the PSU is located on a par with the adapter.

Lian Li PC-O5 features 384x390x133 mm dimensions and weighs 5.4 kg. It is able to accommodate one thin ODD, up to four 3.5-inch or five 2.5-inch drives as well as three PCI expansion cards. The maximal length of compatible graphics adapters makes up 190 mm, the ultimate height of compatible CPU coolers – 70 mm, whereas the maximal length of compatible PSUs – 140 mm. The model is delivered with a pre-installed 140 mm fan, a pair of USB 3.0 ports, and HD Audio connectors.

To …
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Registered at: 05 June 2012, 03:12
Last visit: 05 June 2012, 03:12