The Launch of New Generation Core i3 is Planned for Early September

The recent launch of Intel's Ivy Bridge processors based on a new microarchitecture has touched upon Core i5 and Core i7 series. Currently, the company is working vigorously on the advancement of its Core i3 series, as well as, Pentium G2100T and G2120 models. The latter will be designed on similar to its 'brethren' architecture. In accordance with the voiced information, the new processors will be released in early September.

The nominal lineup of Core i3 processors will include five models; processors with T index (i3-3220T and i3-3240T) will be characterized by low power consumption (up to 35W) and average frequencies which will fluctuate in the ranges of 2.8-3 GHz. Senior models (i3-3220 and i3-3225) will operate at 3.3 GHz and have TDP index of 55W, while the superior model Core i3-3240 will achieve the frequency index of 3.4 GHz. These models are distinguished by the availability of more efficient integrated HD 4000 graphics type.

Upon the whole, the third …

Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.

In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.

Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …

The First Glimpse on Motherboard Foxconn B75M

Foxconn has officially announced the release of a new motherboard B75M developed in microATX form-factor. The new product will be distinguished by an attractive price and available up-to-date kit of interfaces useful for home-based and corporate PCs. B75M will be compatible with Intel Ivy Bridge processors of the third generation (Core i3, i5, and i7). This motherboard employs only high-end components which prevent the system from malfunctions or interruptions: the integration of Japanese solid-state capacitors with the minimal error-free running time which achieves sixty thousand hours. Such approach is more vital for the systems that get used to work in 24/7 mode.

The integrated PCI-E 3.0 bus allows the installation of the most updated graphics adapter. SATA III port empowers the usage of speedy SSDs and HDD potential, while three USB 3.0 ports are destined to ensure the linkage with the external devices at maximal speed index. Motherboard Foxconn B75M is also furnished with …
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Registered at: 11 July 2011, 18:42
Last visit: 11 July 2011, 18:42