Xigmatek to Launch Alfar Chassis This Month

Xigmatek is on the verge of launching its new series of chassis, codenamed Alfar. The series consists of three models which differentiate from each other by the color of insertions on the frontal grid (black, white and orange). The casing itself is made of steel and painted totally black. All three enclosures are designed in mid-tower form factor and are ready to accept motherboards of mini-ITX, micro-ATX and ATX dimensions.



Xigmatek Alfar houses seven PCI expansion slots, can accept CPU coolers of up to 160 mm in height, graphics cards of up to 320 mm in length, and a standard power supply unit. The chassis are furnished with three external 5.25-inch drive bays, four internal 2.5-inch bays, and analogous number of bays for 3.5-inch drives. Interface panel is located on the top board and accommodates a couple of USB 3.0 ports and standard 3.5 mm audio sockets.


The nominal delivery set of Xigmatek Alfar contains two 120 mm fans, located on the frontal and rear boards; …

Corsair Launches Graphite 760T Chassis with a Half-Transparent Panel

Corsair has just started the sales of its newest Full-Tower chassis, entitled Graphite 760T. The new entry features 567x246x564 mm dimensions and is available in two color variations: black and white. The most remarkable peculiarity ascribed to the model is a half-transparent side panel, fixed by special loops. Such framework allows for the integration of system components with a striking design and might become a real attraction in home environment.



Corsair Gpaphite 760T is thought to accommodate motherboards of ATX, E-ATX, Flex-ATX, XL-ATX, and SSI-CEB standard. Its internal layout houses nine PCI expansion slots, three 5.25-inch drive bays, and six 3.5-inch or 2.5-inch drives. I/O panel, located on the top facet, contains a pair of standard 3.5 mm audio sockets and four USB ports (2x 3.0 version, 2x 2.0 version).


To continue, the chassis comes with a well-considered cable management system, where each cable has its own place. Cooling system is represented by two onboard …

Welcome In New LPDDR4 Memory Chips from Samsung

Samsung settles down to a large-scale production of LPDDR4 mobile memory chips. Elaborated according to 20 nm technological norms, the new-comers boast the integration of an advanced technology that ensures 8 Gb crystal density and twice the performance compared with LPDDR3 chips. Currently, the company produces models of 2 GB and 3 GB capacity, however in early 2015 it will set to the development of 4 GB solutions.



New LPDDR4 memory modules are targeting various mobile devices with thirst for lightning-fast data transfer speed. The latter index might accelerate up to 3200 Mb/sec; this will allow employing chips for the implementation of resource-intensive tasks, such as recording and playback of high-resolution video or serial filming.


Samsung developers claim that 2 GB LPDDR4 DRAM is 40% more power-efficient than counterparts with 4 Gb crystal density. This became possible due to the adopting of low-voltage swing-terminated logic for I/O signaling. As a result, the …
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Registered at: 21 October 2012, 09:34
Last visit: 05 November 2012, 08:18