Foxconn Introduces Two Motherboards on Intel NM70 Chipset

Foxconn is proud to introduce a pair of new mini-ITX motherboards, developed on Intel NM70 chipset. Entitled D70S-P and D70S-PD, this couple is intended for the incorporation into small-sized, power-saving and low-noise PCs, workstations, network and multimedia stations. Both new-comers are initially equipped with two-core Intel Celeron U1037 CPUs (Ivy Bridge generation). They operate at 1.8 GHz and consume 17 W only.



Foxconn D70S-P and D70S-PD feature an integrated Intel HD Graphics core that ensures smooth and quality imaging on movie watching (support for Full HD resolutions), game playing (with average demands), Internet surfing, and work with various applications. Cooling of all crucial components, including the key computing block, is secured by means of an aluminum heatsink with an onboard low-profile fan. Despite the dimensions, 170x170 mm only, the product allows for the incorporation of any contemporary hardware pieces.


Therein, memory block consists of a single …

CPU Cooling System Ice Hammer IH-4700 Review

Coolers designed by Ice Hammer have been always noticeable for an appropriate correlation of performance and price. Its cooling system IH-4700 is not an exclusion, since it provides both — perfect cooling effect and attractive final cost. Model IH-4700 is a recipient of the fourth product series which differentiates by an improved framework and more efficient operation. It supports a range of Intel and AMD processors, and features PWM fan controller.



Delivery Set


Cooler Ice Hammer IH-4700 is supplied in a cardbox of medium size. Traditionally, the box contains some technical details about the product and a set of accessories necessary for the installation. The cooler itself is packed in a separate box which involves a subsection for accompanying elements. User's manual contains guidance on the cooler's installation into Intel and AMD platforms. The list of accessories embraces a backplate, a clamping plate, a fixing plate, a set of fixing screws, a thermal compound, and …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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