Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …

PC Case Aresze Enclave 8002 Review

Entry-level customers, as well as inveterate gamers and enthusiasts, have got the whole galaxy of options from PC chassis manufacturers. Mid-tower, mini-tower and full-tower cases are called to satisfy all basic requirements set by consumers. Aresze has been conquering this segment for a long time, thus it knows how to draw potential audience and win its predisposition by high-quality products. Its latest case Enclave 8002, designed specifically for gamers and enthusiasts, is distinguished by a large number of ventilation grids (almost on all panels), independent trilocular temperature CPU/PSU management, PWM fan rotational control, and dedicated dock-station for HDD hot swapping.


Aresze Enclave 8002 is developed in Mid-tower form-factor and features 500x517x210 mm dimensions. The case is made of steel with plastic and foam rubber inclusions. Its external surface is given black and red coloring to absolutely comply with its gaming predestination. This model is …

The third generation of chips Thunderbolt will be released in the second quarter of the next year

Data interface Thunderbolt from Intel company entered the market in February 2011 in the Apple MacBook Pro laptop. By combining in the one interface PCI Express and DisplayPort, it now offers data rates up to 10 Gbit / s. On the more common personal computers the interface began to be applied recently, as part of the laptop and PC top price category.

Intel plans to introduce a new controller interface Redwood Ridge Thunderbolt for use in personal computers in the second quarter of next year. It is likely that the new controllers will form the platform of the Shark Bay for next generation processors under the name of Haswell.

Controllers Redwood Ridge will support completely the same data rate 10 Gb / s, interface DisplayPort v1.1 and function DisplayPort v1.2 Redriver. At present, even the cheapest chips Thunderbolt, 2-channel Cactus Ridge, cost motherboard manufacturers at about $ 20, and many consumers expect that emergence of new generations of controllers will reduce …
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Registered at: 04 May 2012, 20:16
Last visit: 04 May 2012, 20:16