MSI Introduces Newest Z77A-GD65 Gaming Motherboard

First displayed at CeBIT 2013, MSI Z77A-GD65 Gaming motherboard is now showing out in the company’s product line. As suggested by the name and attention-getting design, the board has been elaborated specifically for gaming needs. The new-comer is based on Z77 chipset, features ATX form-factor, and supports Intel LGA1155-compatible processors of the second and third generation (Sandy Bridge/Ivy Bridge).



Among the most attractive facilities ascribed to the model, it’s possible to distinguish the incorporation of Qualcomm Atheros Killer E2200 network platform. This platform provides for a substantial improvement of network connection quality, by means of defining all gaming traffic and assigning it a major priority.


The motherboard is known to employ high-quality Military Class III components, including CopperMOS elements in copper cases, gold-plate throttles with Golden SSC ferrite mandrel, tantalum Hi-c CAP capacitors, as well as solid-state capacitors with …

Foxconn has changed specifications of nettop Nano AT-5250

Due to a sudden «retirement» of the processor Intel Atom D2700, Foxconn company was forced to make adjustments in the equipment of its compact desktop PC Nano AT-5250 on Intel platform. As a result, in its specifications, instead of old CPU, a new dual-core chip Intel Atom D2550 with a frequency of 1.83 GHz has been implemented. As for the version of the nettop, built on a platform of AMD, it is worth noting that its specifications remain the same. It should be mentioned, that here a dual-core accelerated processor AMD E-450 is a “heart” with 1.65 GHz of clock frequency. Its integrated graphics is AMD Radeon HD 6320.



Mini-PC weighs 600 grams, is performed in a black hull with dimensions of 190 x 135 x 38 mm, and is passively cooled.


Among other specifications, its arsenal can boast:

— 4*USB 2.0 ports, 2*USB 3.0 ports, one DVI port and HDMI;

— One SO-DIMM slot for location up to 4 GB of RAM DDR3;

— Bays for installation of one 2.5-inch and one 1.8-inch …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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