Xilence Company has presented a kilowatt power supply unit of XQ series

Taiwanese company Xilence released two PSU of unusual design — XQ Series of 750 and 850 W capacities. In contrast to usual offers on the market, these PSU are equipped with a pair of 60-mm fans. It has separate adjustment of speed and can operate in a completely passive mode at a load of up to 20-30%.



Recently, Xilence added to the above-mentioned series a power supply with nominal 1000W. New model in the pre-sale testing was certified with 80 Plus Platinum, which indicates the level of efficiency from 90% to 94% in the system of 230 V. Like its predecessors, the unit uses a modular principle of cabling, active power factor correction mechanism and complies with ATX12V v2.3 and EPS12V v2.92 standards. The list of available power cables (connectors) is the following: 4x PCI-E 6-pin, 4x PCI-E (6 + 2)-pin, 7x Molex 4-pin, FDD, 12x SATA, EPS12V (4 +4)-pin, EPS12V 8-pin and ATX (20 +4)-pin.


Five-year warranty on the Xilence XQ 1000W provides the possibility of replacement the …

Meet a New 1200 W PSU SuperNova P2 from Evga

Evga, an award-winning American designer of hardware products for enthusiasts, is about to release a really hard-hitting power supply unit of enthusiast-level – the SuperNova 1200 P2. The model strikes the eye by 80Plus Platinum efficiency, backed by 10-year’s limited warranty. The recommended by the designer retail price won’t trespass the height of $270.



Evga SuperNova 1200 P2 features 1200 W power and 90% efficiency on a typical loading. It teases a totally modular layout system, therewith all cables have an atypical design; the latter is called to optimize the airflow within the PSU case. A set of available cables includes 24-pin ATX, a pair of 4+4-pin EPS12V, ten SATA Power, five MOLEX 4-pin, six 6+2-pin PCI Express Power, and a single FDD Power.


The following power supply unit is furnished with a single +12V rail that is estimated for 99.0 A current intensity. The layout houses first-rate Japanese capacitors with a solid electrolyte, a vertical two-layer main …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
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Registered at: 15 March 2011, 02:13
Last visit: 15 March 2011, 02:13