AMD Adds Three New Mobile APUs to Kabini Series

AMD has replenished its mobile APU line with three new models of AMD Kabini series: E2-3800, E1-2200 and A4-5100. The triple is developed on Jaguar microarchitecture (28 nm) with SoC design. Needless to say that the new-comers are destined to be incorporated within hand-held mobile devices, such as entry-level laptops and tablets. All of the models are housed in BGA 769 socket cases, thus the customers might expect their market appearance within ready devices.



SoC design stipulates the integration of a one-channel DDR3 controller with the support for two memory modules. In addition, it allows for the enabling of SD, USB 3.0, HD Audio, PCI Express 2.0, LPC, and SATA 6 Gb/sec interfaces. More details about each model are provided below.


AMD E2-3800


This model features 4 cores, operating at 1300 MHz clock frequency. It employs an onboard Radeon HD 8280 graphics chip that runs at 450 MHz. DDR3 controller supports the installation of modules of up to 1600 MHz frequency. The …

Encouraging Forecasts for Ultrabooks

Notebooks and netbooks, which have been the pioneers in the field of portative devices in the recent past, are now considered to be regular gadgets available practically for all people. IT market is oversaturated with the offers from different companies that produce those devices. Growing competition makes those companies invent new strategies in the development of notebooks, providing customers with more impressive performance and stunning design. The end of 2011 and beginning of 2012 was marked by the launch of new notebook generation, the generation of ultrabooks. The mass production of ultrabooks is prognosticated for the mid 2012.


The developers of portative devices took the challenge to combine the functional characteristics of ultrabooks with their ultrafine design. Such companies as HP, Lenovo, Dell, Acer, and Asustek can be called the pathfinders in this technological sphere and their masterpieces have seen the light already in the end of 2011. The representatives of …

Spire Showcases New Cylinder-Shaped Swirl IV CPU Cooler

Spire is going to release a new extraordinary cooling solution: a cylinder-shaped CPU cooler, entitled Swirl IV. It is targeting Intel processors for Socket 2011/1366/115x/775 and AMD FM1/FM2/AM2/AM3 platforms with the maximum TDP level of 130 W. The new-comer has received RoHS and CE certification that proves its environmentally-friendly nature. An official release is postponed to January 2015.



Spire Swirl IV features 131x125x62 mm dimensions and weighs 690 g. Its heatsink consists of 45 aluminum fins, pierced by three copper zinc-plated U-shaped heatpipes (8 mm). Inside the heatsink one can find a 60 mm fan with blue LED backlit. Its rotational speed is controlled by PWM technology so that the blades could run between 600 RPM up to 2000 RPM.


The fan is equipped with a slide bearing, estimated for 50.000 hours of fool-proof operation. It is powered by means of a 4-pin connector, ensuring up to 83.12 CFM airflow at 26 dB noise. Besides, at the highest rotational speed the …
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