Greeting a Flagship L337 Gaming Z97-Machine Motherboard from ECS

ECS has announced the release of its flagship motherboard based on Intel Z97 chipset – the L337 Gaming Z97-Machine. The model is thought to be used for the creation of some powerful gaming configurations. It employs Socket LGA1150 platform that supports 4th and 5th generation of Intel Core/Pentium/Celeron CPUs. Featuring ATX form-factor (305x220 mm), the board might become an ideal complement to the high-end PC system.

ECS L337 Gaming Z97-Machine houses four DIMM slots for DDR3 memory modules; the maximal capacity of memory might not exceed 32 GB, whereas the maximal clock frequencies might approach 3000 MHz. Storage subsystem offers 4x SATA III 6 Gb/sec ports for the connection of standard drives (support for RAID 0/1/5/10 configurations), 1x M.2 NGFF port for the connection of solid-state drives of diverse length. Expansion facilities involve 2x PCI-e 3.0 x16 connectors and 3x PCI-e 2.0 x16 connectors.

Network LAN operates under gigabit Intel I218 controller. Audio …

Enermax Unveils Staray Lite and Staray Silence Chassis

Enermax Technology Corporation, an established manufacturer of varied PC hardware and peripherals, has unveiled a pair of new chassis, codenamed Staray Lite and Staray Silence. Both products are elaborated in mid-tower form-factor (472x185x421 mm dimensions) and are predestined for those users who suppose quality and reliability a must. These chassis feature very similar external design but their internal layout differs a bit.

Models Lite and Staray are ready to house four external drives of 5.25-inch standard, five internal drives of 3.5-inch standard, and seven expansion slots. They support ATX/micro-ATX motherboards and can accommodate up to four 120 mm fans. Additionally, there is a possibility to install a liquid-cooling system, due to the availability of dedicated holes for cables on the rear facet.

Staray Lite is delivered with only one pre-installed 120 mm fan, located on the frontal panel. It can be supplemented by three more fans on the rear and side facets. I/O …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …
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Registered at: 22 August 2012, 20:04
Last visit: 08 December 2012, 20:43