Company LEPA produces new power supplies B-series

LEPA introduced three new power supplies — B650-SA, B700-MAS and the B800-MAS, which will replace older models B750-MA, and B850-MA. Newcomers have been certified with 80 Plus Bronze (efficiency of 88% of the networks 230V), and met the standards of ATX12V v2.3 and EPS12V 2.92, and positioned as solutions for gamers and owners of GPU configurations SLI and CrossFire, workstations and small servers.



New items are equipped with inverter DC-DC (to improve stability), have the topology of Double Forward Circuit, as well as high-quality electrical components: solid capacitors and heat resistant (105 ° C) capacitors made in Japan.


Active cooling LEPA B700-MAS/B800-MAS is provided by 140-mm fan on double bearings. The model B650-SA has a fan size of 120 mm. The intensity depends on the rates of temperature sensor. Power Cables PCI-E, SATA and Molex flat are detachable. The main ATX 24-pin, as well as “CPU” EPS12V 8-pin are collected in a nylon sheath. LEPA B650-SA has …

Mini-PC Sapphire Edge HD3 Review

Mini-PCs are gaining popularity among people who do not want to relinquish their demands towards the performance and aesthetic appearance. Full-Tower casings will suits probably gamers and enthusiasts, laptops – to people always on move, and mini-PCs — to individuals who appreciate efficiency and ergonomics. Sapphire gladdened its customers with Edge HD2 model last year, and this season the company offers an advanced solution in the form of mini-PC Edge HD3. Indeed, this model can substitute the full-tower PC and provide for better usability.



Design


First of all, it should be mentioned that Sapphire Edge HD3 design befits to its predecessor, HD2. The new model has got rubbered plastic enclosure, smooth shape and black color. The basic attraction for potential clientele is the mini-PC dimensions: the product does not exceed the standard paper format and will be practically invisible on the desk. Still, there is a distinction between the two models. Edge HD3 is notable …

Thermalright Launches New Low-Profile CPU Cooler AXP-200

Thermalright, a Taiwanese developer of advanced cooling solutions, enters into the market with a new low-profile CPU cooler – the successor of the last year’s model AXP-100. Codenamed AXP-200, the product features 150x140x60 mm dimensions and is intended to be incorporated into HTPC systems, as well as in compact PC chassis with the support of mini-ITX motherboards. This cooler is compatible with the majority of up-dated platforms, including Intel LGA 1150/1155/2011/1156/1366/775 and AMD Socket AM3/AM3+/AM2/AM2+/FM2/FM1.



The first thing that should be noted about AXP-200 is that it’s a more powerful version of the predecessor, ready to dissipate heat even without the fan from all processors with TDP level of up to 35 W. The other peculiar thing is that the model comes at an attractive price of approximately €50. And finally, framework is one more feature that differentiates AXP-200 from rival products.


Thereby, the cooler from Thermalright has got C-shape framework …
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Registered at: 19 October 2011, 22:51
Last visit: 19 October 2011, 22:51