Zalman Introduces Highly Efficient FX70 Passive Cooler

Zalman, a renowned South Korean designer of various hardware solutions, has recently introduced its latest CPU passive cooler, entitled FX70. The new-entry features 110x140x158 mm dimensions and comes without any fans. However, if there is a need to cool down CPUs with the TDP level higher than 80 W, the customer is free to enhance the facilities by adding two 120 mm fans. The latter are fixed to the heatsink by means of four brackets.

Zalman FX70 is an optimal choice for the following platforms: Intel LGA 2011/1366/115x/775 and AMD FM2/FM1/AM2/AM2+/AM3/AM3+. This cooler fits in any mid-tower ATX and larger PC chassis. The cooler’s framework consists of a copper base, pierced by six nickel-plated heatpipes, and of fifteen heatsink plates with an offbeat design, codenamed Twist; they are called to dramatically improve the process of heat management.

Fanless framework is regarded to be an advantage due to three reasons. First of all, pure heatsink provides absolutely no …

Promising Speed Forecasts for AMD Radeon 8000 Sea Islands

AMD is continuing its work on the new GPU generation codenamed ‘Sea Islands’. The new series is prognosticated to be released in the coming winter. All the products with this GPU will be branded Radeon 8000. AMD manufacturers claim that their new graphic processing units will be 40% more efficient due to the implemented advanced technologies. There is not so much news about the future GPU architecture, although cardinal changes are barely possible.

Sea Islands chips will be equipped with 5.1 billion transistors as compared with the current 4.3 billion items applied in the products. This augmentation will facilitate the increment of efficiency. The chips will be developed according to the already tried-and-proven 28 nm technological requirements. The increase of transistors is not as large due to the adherence to the ascribed norms. It should be underlined that the implementation of the old technologies does not imply the considerable warming up of the chips; the developments …

Intel Unveils DZ75ML-45K Board with LucidLogix Virtu MVP Support

CES 2013 provided room for Intel to show all its might and recent achievements in PC hardware industry. Hence, the company unveiled a series of new motherboards intended at the overclocking of Intel Core i3, i5, and i7 CPUs of the second and third generation. Model, codenamed Intel DZ75ML-45K, is a bright representative of this series, being a large-scale entry-level solution. It is developed in micro-ATX form-factor and features 226x216 mm dimensions.

Motherboard Intel DZ75ML-45K is based on Intel Z75 chipset and employs Socket LGA1155 CPU slot. Power supply subsystem is designed according to 4+2 scheme, where 4 phases are responsible for CPU management. The board accommodates four DIMM slots for the integration of two-channel DDR3 RAM; its overall capacity might achieve 32GB. Besides, Intel has taken care about wide memory facilities that manifest themselves is various operational frequencies (from 1066 MHz to 2400 (OC) MHz).

All expansion facilities are provided by …
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Registered at: 22 March 2012, 09:35
Last visit: 22 March 2012, 09:35