Intel can provide “successor” Core i7-3770K at the beginning of the next year

According to proven sources, Intel is considering the release the more rapid alternative to quad processor Core i7-3770K, which currently heads the line of Ivy Bridge to the mass market. This happens if the Corporation of Santa Clara will feel the hard pressure from the only competitor (AMD), which is actively working on the first chip Piledriver — FX-8350, FX-8320 and FX-8300. The release of a hypothetical «Core i7-3790K» with a frequency of 3.6 GHz can be held in the I quarter 2013.

The version of «3770-th» with blocked by increased factor (without the suffix K) will not be finished later, in the II quarter of next year, will give way to one of the members of the family Haswell.

Accordingly, the reinforcements will receive the platform LGA2011, which now covers the rear of the quad-core Core i7-3820. Strategies at Intel, most probably also will be limited to the addition of 100 MHz. About a year later models Sandy Bridge-E recede into the background in favor of …

Aerocool Brings Dead Silence Cube Chassis on Market

Aerocool Advanced Technologies puts up for sale its mini-ITX chassis, entitled Dead Silence Cube. The model is an ideal choice for the fans of LAN Parties and those who have an eye for a stylish design. The chassis features 265x411.3x381 mm dimensions, targeting mini-ITX or micro-ATX motherboards. The case is made of solid steel and is characterized by sound-dampening features.

In retail sale it appears in two framework variations — with a blind side facet and with a transparent window on it, – as well as in several color designs. Some of the items boast the incorporation of leather finish on the top and frontal facets.

Aerocool Dead Silence Cube is furnished with one optical drive of 5.25-inch standard, three drives of 3.5-inch standard or four drives of 2.5-inch type, and with four PCI Express expansion slots. Internal spacing is sufficient to integrate graphics adapters of up to 320 mm in length, a customary PSU, and CPU coolers of up to 190 mm in height. The top …

Welcome In New LPDDR4 Memory Chips from Samsung

Samsung settles down to a large-scale production of LPDDR4 mobile memory chips. Elaborated according to 20 nm technological norms, the new-comers boast the integration of an advanced technology that ensures 8 Gb crystal density and twice the performance compared with LPDDR3 chips. Currently, the company produces models of 2 GB and 3 GB capacity, however in early 2015 it will set to the development of 4 GB solutions.

New LPDDR4 memory modules are targeting various mobile devices with thirst for lightning-fast data transfer speed. The latter index might accelerate up to 3200 Mb/sec; this will allow employing chips for the implementation of resource-intensive tasks, such as recording and playback of high-resolution video or serial filming.

Samsung developers claim that 2 GB LPDDR4 DRAM is 40% more power-efficient than counterparts with 4 Gb crystal density. This became possible due to the adopting of low-voltage swing-terminated logic for I/O signaling. As a result, the …
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Registered at: 04 May 2012, 11:26
Last visit: 05 May 2012, 12:39