Eurocom Intros Enterprise-Class Uno 4 All-in-One

Eurocom Corporation, a Canadian guru in gaming laptops segment, is glad to launch a new all-in-one PC, entitled Uno 4. This 21.5-inch device with 527x49x370 mm dimensions is primarily targeting enterprise market, featuring an optimized set of facilities for the solution of various business tasks. It is powered by Intel Haswell Core i5-4210M CPU, running at 2.6 GHz (up to 3.2 GHz on overclocking), accompanied by an integrated HD Graphics 4600 chip. Additionally, there are versions with Core i7 CPUs.

Eurocom Uno 4 boasts a multi-touch display with antiglare coating and LED backlight. It promises Full HD resolution and some striking color rendering. This all-in-one is equipped with 16 GB of DDR3-1600 memory modules, two HDDs/SSDs of 2.5-/3.5-inch form-factor with SATA III interface of up to 2 TB capacity. Moreover, it comes with Blu-ray/DVD drive, a webcam, 9-in-1 card reader, two 3.5 mm mini-jacks for a headphone and a microphone, USB 2.0 and USB 3.0 ports, HDMI output, …

System on Module Sauris AM3517/05 Sales Start

The official website of Sauris company is dazzled by the information about the sales start of the systems on modules AM3517/05. The new systems are based on high-performance microprocessors TI Sitara AM3517 or AM3505 developed in the SODIMM-204 form-factor. System designers have extended the data bus to 16 bit and connected it with the flash-memory chip. The extension of data bus allowed for the acceleration of the OS loading. In addition, the systems are equipped with a new keyboard controller that enables the connection of up to 80 keys; the integration of such solution permitted the designers to refuse from the additional elements of keyboard protection from electrostatic restrictions.

The module configuration includes memory of EEPROM type in 64 KB volume capacity, SDRAM DDR2-166 memory in 256 MB capacity, and flash-memory of NAND type in 256 MB capacity. The interface list boasts a number of facilities including Ethernet 10/100 Mb/sec, CAN 2.0b, USBx2, LVDS, McSPI, McBSP, …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …
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Date of birth: 26 August 1983
Location: Россия, Барнаул
Registered at: 17 April 2012, 05:31
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