Three-Dimensional Monitor HP 2311 GT Review

Three-dimensional technology applied in PC monitors enjoys popularity primarily with more well-to-do people rather than general public. This can be simply explained by the price aspect attached to the issue: 3D monitors with all accompanying equipment are a costly acquirement, and not every customer is ready or can afford buying them for home use. Hewlett-Packard company always tries to comply with the demands and possibilities of their consumers; however, the company does not forget about the development and innovations. Thus, HP delivered three-dimensional monitor with passive polarized 3D technology, codenamed HP 2311 GT.

Design and Specifications

First of all, it should be mentioned that HP 2311 GT is basically oriented on the entry level customers, and this is vindicated by the moderate price policy ascribed to the series. The casing is made of plastic with mould base; this base does not allow any alterations in monitor's height or rotation. The tilt can be adjusted …

Gigabyte to Release GA-Z170X-SOC Force Mainboard for Overclockers

Gigabyte has expanded its line of overclocking solutions by a new motherboard, codenamed GA-Z170X-SOC Force. The greenhorn is based on Intel Z170 chipset, supporting Skylake-S CPUs for LGA 1151 socket (14-nm technological process). The PCB is distinguished by the inclusion of fiery-orange components and a sophisticated allocation of hardware.

Gigabyte GA-Z170X-SOC Force features 22-phase VRM system and three power connectors: ATX12V, EPS12V & OC PEG. The PCB incorporates such high-quality component as DrMOS PowIRstage from International Rectifier. All power elements might be paired with hybrid cooling; for this purpose, the customer has to acquire G1/4 fittings.

The motherboard accommodates 4 slots for DDR4-3300 MHz RAM with the maximal capacity of 64 GB. Storage subsystem might be organized thanks to 9 SATA III ports, 3 SATA Express ports (10 Gb/sec bandwidth index), 3 M.2 Socket 3 ports (32 Gb/sec bandwidth index), and a pair of USB 3.1 Type-A/Type-C ports. Graphical …

Welcome In New LPDDR4 Memory Chips from Samsung

Samsung settles down to a large-scale production of LPDDR4 mobile memory chips. Elaborated according to 20 nm technological norms, the new-comers boast the integration of an advanced technology that ensures 8 Gb crystal density and twice the performance compared with LPDDR3 chips. Currently, the company produces models of 2 GB and 3 GB capacity, however in early 2015 it will set to the development of 4 GB solutions.

New LPDDR4 memory modules are targeting various mobile devices with thirst for lightning-fast data transfer speed. The latter index might accelerate up to 3200 Mb/sec; this will allow employing chips for the implementation of resource-intensive tasks, such as recording and playback of high-resolution video or serial filming.

Samsung developers claim that 2 GB LPDDR4 DRAM is 40% more power-efficient than counterparts with 4 Gb crystal density. This became possible due to the adopting of low-voltage swing-terminated logic for I/O signaling. As a result, the …
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Registered at: 20 December 2011, 16:13
Last visit: 26 December 2011, 09:50