The Vertical NAS Qnap TS-453Bmini Solution Requires Less Space on Your Desktop

Qnap has launched delivery of a vertical NAS under the TS-453Bmini codename.



This storage offers four vertically arranged slots for 3.5” and 2.5” drives with SATA 6 Gbps interface, which significantly minimizes space, occupied by the device. You do not need a screwdriver to fix drivers in sleds. All sections are covered with a common upper lid. The R/W memory slot is located in the basic part of the framework.


One should also highlight the hot swap, RAID 0, 1, 5, 6, 10 arrays formation support and Intel AES-NI hardware encryption with a 256-bit key. The 4-core Celeron J3455 CPU features 4 or 8 GB of DDR3L RAM, distributed over 2 SO-DIMM slots.


The network part consists of two Gigabit Ethernet ports (which can be combined), one USB 2.0, four USB 3.0 ports and an HDMI video output. The 64-bit QTS 4.3 OS supports виртуализацию Linux, Windows, UNIX and Android virtualization, mail and contacts synchronization in a personal cloud.

The new version of the chassis from Zalman Z9 Plus

The company Zalman continues to utilize the design of the whole successful chassis Z9, releasing a new model Z9 Plus D4-U3. Perhaps, the only difference from the recent Z9 U3 is the lower part of the front panel, made in the form of letter D.



The list of applied characteristics has remained the same. The body is made of steel and plastic in the form factor Mid-Tower. Its dimensions are 504 (L) x 207 (W) x 464 (H) mm, weight — a little over 7 lbs. Inside can be placed the motherboard ATX or microATX, seven cards PCI-E expansion up to 290 mm, ATX-compatible power supply, three optical drives, and seven hard drives, including two SSD 2.5 format.


The set includes two 120-mm fan — in front with the LED-backlit display and on the back without it. On the input-output is a small information display, two USB 3.0 ports and USB 2.0, Mini-Jack connectors for headphones and microphone.


Zalman Z9 Plus D4-U3 will debut in Japan and perhaps in some other markets, August 19 at a …

Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.



In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.


Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …
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