AMD Announces the Development of Steamroller

Heightened demand for high-end processor solutions and ever rising competition make AMD constantly develop its products. This usually results in the release of really outstanding items, such as already acknowledged Bulldozer and Piledriver. Therefore, according to the words of the companies technical manager, Mark Papermaster, the development of a new processor architecture, codenamed Steamroller, is already on order of AMD's business. The ready-made products are sure to be released next year. Steamroller is called to become the third edition of Bulldozer architecture that launched last year and a loyal companion of Piledriver core.

The initial data witness that processors on Steamroller architecture will be designed in correspondence with 28 nm technological process. This should favorably affect their efficiency and enlarge the performance by 15-20% at equivalent power consumption and clock frequency. At the same time, Steamroller will improve all specifications implemented in …

Biostar Unveils Specifications of A55MLV Motherboard

Biostar has given its new motherboard A55MLV certain prominence, unveiling its main specifications on the official website. Relying on the claimed data, a new product is developed in micro-ATX form factor and is targeted primarily at compact desktops applied in home and office systems. What is more, this motherboard aims at drawing customers who struggle for utmost performance, limitless facilities, and moderate price.

Biostar A55MLV is based on AMD A55 system logics and accommodates Socket FM1 to be compatible with a number of high-end processors. It supports the following APUs from AMD which TDP level does not exceed 100W: E2, A4, A6 and A8 series. This motherboard contains two DIMM slots that support up to 16GB of DDR3 memory type (800, 1066, 1333, 1600, 1866), operating at one-channel or two-channel modes.

The model boasts the availability of four SATA II ports, a single PCI port, one PCI-e 2.0 x16 port, six USB 2.0 ports, network Ethernet LAN 10/100 (Atheros AR8152), …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.

The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
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Registered at: 09 January 2012, 21:51
Last visit: 10 January 2012, 23:31