Greeting Hi-Fi H81MDC Motherboard from Biostar

Biostar is proud to release a multifunctional micro-ATX motherboard that belongs to the new-gen Puro Hi-Fi lineup. Codenamed Hi-Fi H81MDC, it features 244x230 mm dimensions and is characterized by black-and-red PCB design. The board is based on Intel H81 Express chipset, supporting LGA1150-compatible CPUs of Haswell generation (Pentium, Core i3/i5/i7 series) with the maximal TDP of 95W.



Biostar Hi-Fi H81MDC is primarily peculiar by the realization of a high-end audio subsystem. It is based on a 7.1-channel Realtek ALC892 controller. This subsystem embraces high-quality components, as well as an additional shielding, called Hi-Fi Ground) of the multi-layer PCB. Support of Hi-Fi Power technology provides for an independent power supply to each analog and digital audio channel. The plate is protected against electrostatic discharge on connection of headphones/a microphone.


To proceed with audio subsystem, it comes with an onboard amplifier for headphones; it ensures the …

Lian Li to Combine Performance with Compact Size

Chassis of Full-Tower form-factor usually have solid framework due to the layout scheme and the necessity to enclose a lot of components. Developers from Lian Li company have totally demolished the current tendencies and announced the release of their PC-V750 Full-Tower model with the front-end PSU localization. This allowed the designers to dramatically decrement the size of the chassis without sacrificing its capacity and general specifications. The compact size of the chassis is considered to be a kind of ‘revolution’ in the market, since it is compatible not only with ATX and microATX motherboards, but also with Extended-ATX boards.



Lian Li PC-V750 casing is made of aluminum and approximates 7.35 kg in weight. Its dimensions provide for the installation of massive CPU-coolers (up to 170 mm in height), up to ten expansion cards, including 380 mm 3D cards. The chassis is equipped with five fans of 120 mm each: the two fans are located on the front plate, the other two – …

Spire Showcases New Cylinder-Shaped Swirl IV CPU Cooler

Spire is going to release a new extraordinary cooling solution: a cylinder-shaped CPU cooler, entitled Swirl IV. It is targeting Intel processors for Socket 2011/1366/115x/775 and AMD FM1/FM2/AM2/AM3 platforms with the maximum TDP level of 130 W. The new-comer has received RoHS and CE certification that proves its environmentally-friendly nature. An official release is postponed to January 2015.



Spire Swirl IV features 131x125x62 mm dimensions and weighs 690 g. Its heatsink consists of 45 aluminum fins, pierced by three copper zinc-plated U-shaped heatpipes (8 mm). Inside the heatsink one can find a 60 mm fan with blue LED backlit. Its rotational speed is controlled by PWM technology so that the blades could run between 600 RPM up to 2000 RPM.


The fan is equipped with a slide bearing, estimated for 50.000 hours of fool-proof operation. It is powered by means of a 4-pin connector, ensuring up to 83.12 CFM airflow at 26 dB noise. Besides, at the highest rotational speed the …
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Registered at: 05 January 2012, 13:48
Last visit: 05 January 2012, 13:58