Company LEPA produces new power supplies B-series

LEPA introduced three new power supplies — B650-SA, B700-MAS and the B800-MAS, which will replace older models B750-MA, and B850-MA. Newcomers have been certified with 80 Plus Bronze (efficiency of 88% of the networks 230V), and met the standards of ATX12V v2.3 and EPS12V 2.92, and positioned as solutions for gamers and owners of GPU configurations SLI and CrossFire, workstations and small servers.



New items are equipped with inverter DC-DC (to improve stability), have the topology of Double Forward Circuit, as well as high-quality electrical components: solid capacitors and heat resistant (105 ° C) capacitors made in Japan.


Active cooling LEPA B700-MAS/B800-MAS is provided by 140-mm fan on double bearings. The model B650-SA has a fan size of 120 mm. The intensity depends on the rates of temperature sensor. Power Cables PCI-E, SATA and Molex flat are detachable. The main ATX 24-pin, as well as “CPU” EPS12V 8-pin are collected in a nylon sheath. LEPA B650-SA has …

Motherboard ECS Z77H2-A4 Review

Chipset Intel Z77 can’t be called a novel product in the market, since it has already transformed into a customary platform for personal computers. The versatility of motherboards employing this chipset is countless, in fact, and each and every consumer is able to find the one to his specific needs. ECS boasts its own inventory of boards based on Intel Z77; Z77H2-A4 is an intermediate item between hi-end and entry-level models, due to its alluring price and improved functional facilities. This board attracts primarily thrifty customers who would like to get all modern commodities for a sensible price.



Design and Layout


Budgetary orientation of ECS Z77H2-A4 motherboard is manifested, first of all, through a diminished PCB dimensions. Nonetheless, the model accommodates a couple of PCI Express Graphics slots with the allotted twenty rails of PCI-e bus. There is no symmetric rail distribution between the slots, so the second PEG slot receives only four rails. The board’s …

Top-Tier Chassis Zalman H1 Review

Zalman has long been deprived of a full-tower flagship PC chassis, after it discontinued the line of GS1200. The anticipation of a new etalon was accompanied by an overall market uncertainty as for the future of desktop platforms. Luckily, laptops and tablets couldn’t fully satisfy the customers’ growing needs, so Zalman decided to fire off with a new top-tier case, entitled H1. Stylish and magnetic from outside, this model has a lot of interesting options in the bins. Let’s have a look at them.



Key Features


Zalman H1 is a full-tower case, featuring 561x238x570 mm dimensions. The chassis is made of steel, aluminum and a high-quality plastic, with exterior and interior totally painted black. Internal layout allows for the installation of motherboards with elongated PCBs, including E-ATX and XL-ATX models. The model houses three external bays for 5.25-inch drives, seven internal bays for 2.5-/3.5-inch drives as well as nine expansion slots.


The case boasts some …
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Registered at: 23 August 2011, 15:40
Last visit: 23 August 2011, 15:40