Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …

GeIL Introduces Memory Module Series Evo Leggera

GeIL has lately introduced a new series of memory modules, codenamed Evo Leggera. According to the words of the manufacturers, this series is ready to demonstrate the utmost performance in combination with the low-profile VELOCE radiators which cannot stop the users from installing huge CPU coolers. Evo Leggera represents an optimal solution and improved functionality in one product. The series includes modules of 1333 MHz to 2800 MHz frequencies compiled in two- and four-channel kits.



Evo Leggera is equipped with advanced low-profile heat dispensers 'Leggera' developed with the implementation of Maximum Thermal Conduction and Dissipation technology. This technology ensures efficient cooling activity with the standard module heights. Memory modules Evo Leggera are compatible practically with all newest logics kits, involving Intel Z77 platform. This expands the versatility of the series.


To continue, it should be mentioned that all models in the series have undergone tough …

Cooler Master N300 and N500: PC Cases of Medium Price Tier

Cooler Master announces a release of two new PC cases of mid-tower form-factor. Codenamed N300 and N500, the couple belongs to the medium price tier products and is differentiated by a laconic design combined with a thoughtfully elaborated cooling. Each model features a totally black coating and grid-like frontal panel. In retail market these cases will be offered in two framework variations: with blind side panels and with a large transparent window on one of the panels.



Both models are thought to support motherboards of standard ATX and micro-ATX dimensional type. The most notable peculiarity is the cooling system that primarily consists of two pre-installed 120 mm fans (in the frontal and rear parts of the case); however, this pair might be easily supplemented by seven (with blind construction) or five (with windowed construction) fans more. Moreover, there is a feasibility of incorporating a liquid-cooling system. Some key specifications of both novices are featured below.
AUTOMATIC SEARCH & INSTALL
device drivers
Freeware
Download (9MB)
DevID agent v4.37
* The Utility requires installation. Upon installation and running DevID Agent will detect
which devices require drivers and which drivers require updates.
The Utility doesn't contain viruses or malicious code
Registered at: 14 July 2011, 17:40
Last visit: 24 October 2011, 13:42