Enermax Announces Fulmo ST ECA3270 Flagship PC Chassis

Enermax boasts a new Mid-tower PC chassis developed specifically for inveterate gamers. Codenamed Fulmo ST ECA3270, this chassis is ready to welcome the motherboards of ATX or micro-ATX form-factor, along with eight expansion slots. In retail sale the model will be available in two variations: Fulmo ST ECA3270A and Fulmo ST ECA3270B. The difference between them lies in the color of cases (black and gray-black) and in the amount of pre-installed fans.



Upon the whole, Enermax has taken care about sufficient internal spacing for the creation of a really powerful gaming system. Thus, the chassis is able to house CPU coolers of up to 185 mm height, three two-slot graphics cards with the maximal length of 286 mm; it’s also feasible to free some space for more lengthy adapters (up to 412 mm), due to the demounting of dedicated drive bays. Fulmo ST ECA3270 has got enough space for the installation of eight 3.5/2.5-inch drives. The nominal delivery set contains an additional bay for a …

Qualcomm Unveils Snapdragon 425, 435 & 625 Mobile CPUs

Qualcomm has added three new mobile processors to its Snapdragon lineup. The Snapdragon 425, 436 and 625 boast improved functional, higher level of performance as well as longer-time of off-line operation for tablets & smartphones. The triplet entails 4/8 ARM Cortex-A53 CPU cores which run at 1.4 GHz (425, 435)/ 2.0 GHz (625 model) frequency.



The least efficient CPU is Qualcomm Snapdragon 425. It’s equipped with Qualcomm Adreno 308 graphics core and shows compatibility with eMMC 5.2 drive, LPDDR-667 MHz RAM, 16-megapixel cameras of 1280x720 resolution. Qualcomm Snapdragon 435 accommodates a more efficient Adreno 505 graphics core. It is able to cooperate with LPDDR3-800 MHz memory, internal eMMC 5.1 drives as well as external SD 3.0 memory cards.


In its turn, Qualcomm Snapdragon 625 is thought to be the most powerful CPU in the series. It is based according to 14-nm technological process and Adreno 506 GPU. This model can work with LPDDR3-933 MHz RAM and 24-megapixel …

A Low-profile SilverStone NT08-115XP Cooling System

Nowadays compact systems are becoming more widespread, thus increasing the popularity of low-profile cooling systems. Specifically for such systems, the SilverStone Company has designed a low-profile air cooling system under the NT08-115XP codename.



NT08-115XP is announced to be an alternative to a standard cooler out of the CPU supply kit. The manufacturer states, that this cooling system is able to disseminate up to 65 W of heat, so it’s not effective enough to chill down powerfull CPUs.


The dimensions of the SilverStone NT08-115XP cooling system are the following: 101 x 101 x 33 mm. It possesses an aluminum heatsink with a copper center hub. The rotary speed of the 80 mm fan (10 mm thick) is in the range of 1200–3400 rpm, producing an air flow of 5.64–15.98 CFM (9.58–27.15 m3/hr) and a noise level of 16.5–28.98 dBA.


This specialty is compatible with Intel LGA 115x sockets only.


The price has not been voiced yet.
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Registered at: 03 October 2011, 11:53
Last visit: 12 October 2011, 11:42