Shuttle SH87R6: Barebones Mini-PC with Outstanding Capabilities

Shuttle is happy to introduce its new elaboration – barebones system on Intel Haswell basis, codenamed SH87R6. The new-comer joins the ranks of XPC series and features 332x216x198 mm dimensions. It offers all users freedom in assembling PC systems of various configurations and is predestined to be employed as HTPC system or as a device for professional digital multimedia.

Mini-PC Shuttle SH87R6 supports the latest Intel’s processors of Intel Haswell family (Core i3/i5/i7) and comes with an integrated Intel HD Graphics that is compatible with DirectX 11.1 technology. Haswell-based systems might boast some striking performance and computing characteristics. The model comes also with four full-size DIMM slots for the integration of DDR3 memory modules (up to 1600 MHz and 32 GB capacity) and 300W PSU, certified with 80Plus Bronze standard. The latter is able to provide for the best efficiency and power-saving operation.

Expansion facilities are offered by one PCIe x16 slot …

SilverStone Showcases a Pair of New Add-Ons to the Strider Gold S Series

SilverStone has recently replenished its production lineup with a pair of new power supply units. Codenamed Strider Gold SST-ST75F-GS and SST85F-GS, the couple has entered the award-winning Strider Gold S series. As seen from the codenames, the units are estimated for 750 W and 850 W power correspondingly. Thanks to the incorporation of unprecedented features and some 90% efficiency, the products has picked up 80Plus Gold award.

The Strider Gold S new-comers feature a totally modular design and are developed in ATX form-factor. They are equipped with a single +12V bus. The latter is able to ensure the maximal performance for a gaming system, due to the maximal current of 62/70 A for the junior and senior models respectively.

It should be noted that SST-ST75F-GS and SST85F-GS correspond to all actual security standards. As a result, the units support voltage stabilization features (in the range of ± 3%), as well as vibration-proof and noise reduction features. This …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …
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Registered at: 13 May 2012, 15:31
Last visit: 13 May 2012, 15:31