Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …

Greeting Versa H23 and H23 Window Cases from Thermaltake

Budget-oriented series of PC cases from Thermaltake has been replenished with two new models: Versa H23 and Versa H23 Window. The mere difference between the two enclosures is the availability of a side-faceted acrylic window in ‘Window’ version. Still, both mid-towers feature 429x209x491 mm dimensions and come with a totally black coating. Their internal spacing is sufficient to include standard ATX, as well as contracted micro-ATX motherboards.



Thermaltake Versa H23 and H23 Window boast two 5.25-inch, six 2.5-inch and three 3.5-inch trays for the installation of various drives. All of them might be mounted without any special tools, due to a polished clipping system. The cases offer seven PCI slots to expand the system’s functional.


Additionally, the models support the installation of CPU coolers of up to 156 mm in height, graphics cards of up to 315 mm in length, and a standard PS/2 power supply unit. The I/O panel is located in the top-front panel. It embraces …

Meet Small-Sized QC5000M Mainboard from ASRock

ASRock enters the mainboard market with a new micro-ATX solution, entitled QC5000M. The greenhorn takes Kabini platform as the basis, featuring AMD A4-5000 hybrid processor (28 nm) with 4 Jaguar cores and 1.5 GHz clock frequency. The APU is accompanied by two slots for one-channel DDR3-1600 MHz RAM (up to 32 GB) and an integrated AMD Radeon HD 8330 graphics (500 MHz clock frequency, compatibility with DirectX 11.1 standard).



The implemented APU boasts 15 W TDP only, requiring a small-sized heatsink for efficient cooling. The model takes power via 24-pin ATX connector and is based on AMD A68 chipset. It is equipped with a single PCI Express 2.0 x16 slot, a pair of PCI Express 2.0 x1 slots, and the same amount of SATA III 6 Gb/sec ports.


Network and audio facilities are represented by Realtek RTL8111GR Gigabit Ethernet controller and 7.1-channel Realtek ALC887 codec respectively. Additionally, the PCB is furnished with ELNA sound capacitors. The rear side of the motherboard …
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Registered at: 14 January 2012, 21:13
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