The Mass Market Segment of 3D Graphics Cards Has Been Replenished with the Asus Expedition GTX 1070 Sample

According to several sources, the Asus Co. has introduced a brand-new 3D video card, called Expedition GeForce GTX 1070. The novelty is primarily geared toward customers willing to assemble a productive system and simultaneously to cut costs to the maximum. Reportedly, this graphics card will gain popularity among managers of PC bangs being so widespread in China nowadays.



One should highlight, that the graphics processor of Asus Expedition GTX 1070 is factory overclocked. The base clock equals to 1,607 MHz, and the overclock – to 1,797 MHz. The configuration features 1,920 CUDAs and 8 GB of memory. The manufacturer admits, that 3D Expedition cards undergo a thorough 144 hours testing, including 15 hours of 3DMark checking.


The cooling system of this graphics card is rather simple and is made of a pair of 80 mm fans, an aluminium heatsink and two copper nickel-plated heat pipes. There is no precise information about the PC-board, though, it’s supposed to possess a …

LaCie Updates a High-End 5big NAS-Server

LaCie, a reputable French manufacturer of premium storage devices, has updated its award-winning NAS, codenamed LaCie 5big, filling it with a bunch of cutting-edge options. The greenhorn is targeting corporate field and intended at a problem-free data backup, 4K video editing, joint and remote access to data, etc. The storage is housed in a solid aluminum chassis and counts five drive bays. Nonetheless, it features 173x220x196 mm dimensions only, which makes it the most compact NAS with the largest storage capacity in the market.



LaCie 5big will be available in three versions with the maximal capacity of 10 TB, 20 TB and 30 TB. The most outstanding peculiarity pertained to the model is the support of high-speed Thunderbolt 2 interface, represented by two ports. Initially, the storage presupposes the integration of five 6 TB hard drives, designed by Seagate, with the 7200 RPM spindle operation.


All the drives might be joined into RAID 5 configuration for a better …

Thermalright Launches New Low-Profile CPU Cooler AXP-200

Thermalright, a Taiwanese developer of advanced cooling solutions, enters into the market with a new low-profile CPU cooler – the successor of the last year’s model AXP-100. Codenamed AXP-200, the product features 150x140x60 mm dimensions and is intended to be incorporated into HTPC systems, as well as in compact PC chassis with the support of mini-ITX motherboards. This cooler is compatible with the majority of up-dated platforms, including Intel LGA 1150/1155/2011/1156/1366/775 and AMD Socket AM3/AM3+/AM2/AM2+/FM2/FM1.



The first thing that should be noted about AXP-200 is that it’s a more powerful version of the predecessor, ready to dissipate heat even without the fan from all processors with TDP level of up to 35 W. The other peculiar thing is that the model comes at an attractive price of approximately €50. And finally, framework is one more feature that differentiates AXP-200 from rival products.


Thereby, the cooler from Thermalright has got C-shape framework …
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Registered at: 03 June 2011, 18:19
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