The Intel Company Is Going to Give a Roland for an Oliver to AMD Ryzen

A short while ago the French Canard PC Hardware magazine has reported, that Intel is going to give fitting reply to AMD Ryzen pilot projects and plans to release two new Kaby Lake-S CPUs.



The first processor is expected to be launched under the Intel Core i7-7740K codename. It will get four compute cores with Hyper-Threading support, 8 MB of tertiary memory cache, unlocked multiplier and the 100 W basic TDP rate. Operating frequencies will lie in the range of 4.3–4.6 GHz in the Turbo Boost mode.


The second specialty is Core i5-7640K with four cores and 4–4.4 frequency of operation. It also features 6 MB of L3 cache, 100 W TDP and the support of Hyper-Threading technology, though we can’t be sure as for the last-named specification. One should admit, that heretofore only the Intel Core i7 line offered multithreading in its 4-core desktop processors.

Meet Strike-X Air and Vx Advance Series from Aerocool

Devotees of a futuristic design and uncommon framework cannot but revel in the launch of new chassis Strike-X Air from Aerocool developers. The long-awaited product is already in the market, as well as new Vx Advance series. Chassis Strike-X Air is distinguished by the ultra-original design and open-end framework type. According to the words of Aerocool representatives, the major emphasis has been made on the handiness of usage so that each person could have a direct access to any component of the chassis.



The chassis of Strike-X Air is made of steel and supports motherboards of Micro ATX, E-ATX and ATX dimension type, and graphics cards of 330 mm. length. Expansion cards and interface panels are installed due to the ten slots in the rear part of the device. The chassis is equipped with three external modules of 5.25 and 3.5 inches type. The clipboard is intended for a single USB 3.0 socket, three USB 2.0 sockets, and a couple of 3.5 mm. sockets for headsets with a microphone. … …

Next year TSMC will start manufacturing the first 20nm chips

The Taiwanese company TSMC confirmed its intention to start production of chips using 20 nm technological processes in 2013. However, for now the company does not plan its production on an industrial scale and will release the first chips in a limited quantities, giving them a total of 1% of production capacity. According to the head of the company, the mass production of semiconductor chips with this technology will not begin until 2014.



Meanwhile TSMC Company is going to produce only one version of the chip, which will be able to enter into the wide range of devices, from smart phones with low-power to high-performance graphics cards. For comparison, the Taiwanese company currently has four different output chips on 28-nm technology. These are 28LP (poly / SiON) for low-power low-cost chips, 28HPL (HKMG) for use in low power applications, 28HP (HKMG) for high-performance chips and 28HPM (HKMG). The latest version combines elements of high-performance chips with high efficiency …
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Registered at: 06 April 2011, 10:21
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