Xeon Phi: Revolutionary Offer from Intel Developers

Intel Corporation has made a resolute step towards the improvement of performance demonstrated by ‘supercomputers’. Its new Intel Xeon Phi is called to create a real revolution in the IT world, offering unmatched performance showings on activities with the high parallelism degree. This is supposed to bring supercomputers to the new level by means of enlarging the performance levels from TFLOP to EXAFLOP. Upon the whole, Xeon Phi is the name which will be used for further line of products based on Intel MIC architecture.

Xeon Phi coprocessors are sure to enable the transmission of the reduced data via PCI slots and will primarily be applied to dedicated coprocessors. The sales start is designated to the end of the current year, and the first products presented in the market will be items which belong to Knights Corner series. According to the Intel developers’ words, Xeon Phi will firstly replenish the series of central processors Intel Xeon E5-2600/4600; further on, the …

Motherboard Gigabyte Z77MX-D3H TH Review

Each new year brings new ideas for the developers of PC hardware. Since motherboards are indisputably the main component in the PC integration, their design and facilities are given the most attention. Hence, each manufacturer tries to implement some unprecedented technologies to attract potential audience by an improved performance and possibilities. Intel Thunderbolt technology is a hit of 2012; that is why, motherboard designers turned their looks into this direction. Gigabyte was among the first companies to integrate Thunderbolt interface into its products: model Z77MX-D3H TH is a bright evidence of it.


Motherboard Gigabyte Z77MX-D3H TH resembles the modification of its predecessor Z77MX-D3H, except for the availability of Thunderbolt interface and design of PCB. The renunciation of the third PCIe x16 slot allowed the manufacturer to free four lines of PCIe bus and employ Thunderbolt technology for their activation. As a result, a new product has got a …

Welcome In New LPDDR4 Memory Chips from Samsung

Samsung settles down to a large-scale production of LPDDR4 mobile memory chips. Elaborated according to 20 nm technological norms, the new-comers boast the integration of an advanced technology that ensures 8 Gb crystal density and twice the performance compared with LPDDR3 chips. Currently, the company produces models of 2 GB and 3 GB capacity, however in early 2015 it will set to the development of 4 GB solutions.

New LPDDR4 memory modules are targeting various mobile devices with thirst for lightning-fast data transfer speed. The latter index might accelerate up to 3200 Mb/sec; this will allow employing chips for the implementation of resource-intensive tasks, such as recording and playback of high-resolution video or serial filming.

Samsung developers claim that 2 GB LPDDR4 DRAM is 40% more power-efficient than counterparts with 4 Gb crystal density. This became possible due to the adopting of low-voltage swing-terminated logic for I/O signaling. As a result, the …
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Registered at: 31 May 2012, 17:13
Last visit: 31 May 2012, 17:13