Adata Announces a Couple of External High-Speed DashDrive Elite SSDs

Adata Technology, a Taiwanese manufacturer of RAM modules and diverse flash peripherals, announces the release of two new external solid-state drives that entered DashDrive Elite lineup. Codenamed SE720 and SE810, this couple positions itself quite differently: the first model is oriented at OS Windows users, while the second model is targeting Mac users. Despite diverse predestination, both drives are ready to offer high performance combined with extreme reliability.



Adata DashDrive Elite SE720 will be available in two flash-memory capacities: 128 GB and 256 GB. Each model features a thin, stainless metallic case with 8.9 mm depth and scratch-proof surface. These solid-state drives employ USB 3.0 interface and are powered via USB cable. They are known to support a built-in option of quick backup, which is enabled just by pressing one button. Additionally, SE720 drives have got a convenient LED indication system that notifies the user about the data transfer process.

Asus Announces ROG Poseidon GTX 780 Adapter with DirectCU H2O

Asus has officially introduced a new add-on to the GTX 780 graphics cards series – the ROG Poseidon GTX 780 (codename: Poseidon-GTX780-P-3GD5). The new-comer is initially differentiated by the incorporation of a hybrid DirectCU H2O cooling system, as well as of prime-quality components. The heart of the model is Nvidia GK110 GPU with 2304 CUDA cores. It operates at 1006 MHz. the GPU is accompanied by 3 GB of GDDR5 memory (384-bit bus), running at 1502 MHz (6008 MHz – efficient).



Asus ROG Poseidon GTX 780 employs a qualitative printed circuit board that boasts 10-phase Digi+ VRM digital power subsystem. Reliability of operation is ascribed to Black metallic solid-state capacitors, ferrite chokes with Super Alloy Power support, and classy transistors. They take care of the card’s lifespan, which, according to some reports, is five times longer than rival models feature.


To continue, hybrid DirectCU H2O combines a traditional air cooler along with liquid cooling. The …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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Registered at: 22 October 2011, 15:36
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