ASRock Unveils Z170M OC Formula Mainboard

ASRock came into the market with a new small-sized overclocking-oriented mainboard. Entitled Z170M OC Formula, the model is designed in micro-ATX form-factor on the basis of Intel Z170 chipset. The latter is ready to cooperate with Intel Skylake CPUs for Socket LGA1151. The PCB offers a pair of DIMM slots for DDR4-4500 MHz RAM (up to 32 GB capacity).



ASRock Z170M OC Formula accommodates three PCIe 3.0 x16 expansion slots, enabling the creation of various graphics configurations (including Nvidia SLI & AMD CrossFireX). Storage subsystem is introduced by a pair of SATA Express ports (10 Gb/sec) as well as four SATA ports (6 Gb/sec) and one Ultra M.2 slot (32 Gb/sec).


This motherboard boasts a high-quality audio subsystem; it is based on Realtek ALC1150 controller, generating 7.1-channel sounding (Purity Sound 3). The 10-layer PCB comes with an integrated 14-phase power subsystem with dual-stack MOSFETs, premium choke coils, and solid-state capacitors Nichicon 12K Platinum. …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …

NZXT Rolls Out a New Chassis Phantom 630 Windowed Edition

NZXT has proudly announced the release of its newest PC chassis, codenamed Phantom 630 Windowed Edition. Being a modified version of Phantom 630 model, the ‘greenhorn’ is developed in ultra-tower form-factor, featuring a side-panel window. The case supports quite large motherboards (ATX, EATX, XL-ATX, and micro-ATX) and offers nine expansion slots.



Despite visual discrepancy with the original model, Windowed Edition preserved some of its basic features. Therefore, it allows for the integration of four 5.25-inch drives and eight 3.5/2.5-inch ones. The latter are installed into modular bays which can be removed if necessary. The chassis is ready to accept CPU coolers of 200 mm in height and long graphics adapters (up to 325 mm in length). In case the user decides to remove the internal drive bays, it will become possible to employ much longer adapters, up to 507 mm!


The other peculiarity of Phantom 630 Windowed Edition is the feasibility to incorporate two 2.5-inch …
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Registered at: 05 October 2011, 05:33
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