New RAM Modules Ballistix Sport SODIMM from Lexar Media



Lexar Media, a well-known American designer of diverse digital media products, starts selling its new RAM series from Ballistix line. Entitled Sport SODIMM, the series is introduced by four SODIMM-DDR3 modules, intended for the incorporation into gaming laptops: BLS4G3N169ES4, BLS8G3N169ES4, BLS4G3N18AES4, and BLS8G3N18AES4. The quadruple is distinguished by an original design with the implementation of unique heatspreaders. All of them are optimized for Intel Core i5/i7 mobile processors of the fourth generation (Intel Haswell platform) and support all up-dated XMP profiles.


The most beneficial feature applied to Ballistix Sport SODIMM modules is their power-saving nature. They are able to operate at 10% lower power voltage than analogous products; hence, they reduce the laptop’s power consumption index and increase the time of its offline work.


To continue, the first two models, BLS4G3N169ES4 and BLS8G3N169ES4, come in 4 GB and 8 GB capacities correspondingly. They …

Lifting the Veil from USB Type-C Bus

Since the launch in 1995, Universal Serial Bus (USB) has proved itself as the most successful ever computing interface. Nowadays tens of billions of electronic devices are connected together due to it. It goes without saying that this bus has outlived a few modifications, each distinguished by higher speed and reliability. Thus, today the community is able to revel in a completely new modification – USB Type-C – that forecasts a lot privileges of connectivity process. Let’s see what users will get with a new bus.



Layout and Connectivity


In physical terms, Type-C is a bit larger than USB 2.0 Micro-B but a bit tinier than binary USB 3.0 Micro-B, featuring 8.34x2.56 mm. Such dimensions enable its connection to the devices of any type, including the thinnest smartphones/tablets. The oval-shaped socket houses 24 contact outputs (to compare: USB 3.0 sockets feature only 9 outputs).


The most outstanding physical peculiarity of Type-C is a symmetric connector that …

MSI works on development on three Mini-ITX motherboards based on chipsets A85, B75, and Z77

During August, MSI will release the two motherboards LGA1155 form-factor Mini-ITX, based on chipset Intel B75 and Z77. The first is positioned as a budget solution, the second is, in addition to support of overclocking Ivy Bridge K factor, will offer enhanced power system, and integrated Wi-Fi adapter and Bluetooth. Before the start of retail sales APU A-Series/Trinity (October) they will be joined by Mini-ITX motherboard based on chipset AMD A85.



From the pair of tiny “motherboards” B75/Z77 the greatest interest is for last one. The full codename of the model — MSI Z77IA-E53.


The upcoming model has seven power phases of processor socket with elements DrMOS and tantalum capacitors, power connector EPS12V 8-pin, two slots for RAM DDR3 (up to 16 GB of RAM) and a slot PCI Express 3.0 x16. Also, there are two SATA ports with a throughput of 3 and 6 Gb / s, single eSATA and mSATA (3 Gb / s). Jack mini-PCIe 5 GT / s is located directly above the mSATA — the original …
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Registered at: 28 August 2012, 20:30
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