Arctic Cooling Unveils New Freezer i32 & A32 CPU Coolers

Arctic Cooling AG replenishes its line of CPU coolers with a couple of new-comers. The Freezer i32 and the Freezer A32 feature analogous dimensions (123x95x150 mm), but are targeting to work with different platforms. The first model is compatible with Intel Socket LGA 2011 and 115x platforms, whereas the second version is predestined for the CPUs targeting AMD AM2/AM2+, AM3/AM3+, FM1 and FM2 platforms.



Arctic Cooling Freezer i32 & A32 consist of an aluminum heatsink with 45 thin plates and four U-shaped 6-mm copper heatpipes which support direct touch technology. It goes without saying that these coolers come equipped with a fan. This is a 120 mm propeller that supports PWM technology; the latter enables the change of rotational speed from 0 to 1350 RPM. The maximal TDP level of the catered CPUs should not exceed 150 W.


A dedicated bearing technology with alloy/lubricant combination provides for a lower friction and higher heat dissipation efficiency. The nominal delivery …

Spire Showcases New Cylinder-Shaped Swirl IV CPU Cooler

Spire is going to release a new extraordinary cooling solution: a cylinder-shaped CPU cooler, entitled Swirl IV. It is targeting Intel processors for Socket 2011/1366/115x/775 and AMD FM1/FM2/AM2/AM3 platforms with the maximum TDP level of 130 W. The new-comer has received RoHS and CE certification that proves its environmentally-friendly nature. An official release is postponed to January 2015.



Spire Swirl IV features 131x125x62 mm dimensions and weighs 690 g. Its heatsink consists of 45 aluminum fins, pierced by three copper zinc-plated U-shaped heatpipes (8 mm). Inside the heatsink one can find a 60 mm fan with blue LED backlit. Its rotational speed is controlled by PWM technology so that the blades could run between 600 RPM up to 2000 RPM.


The fan is equipped with a slide bearing, estimated for 50.000 hours of fool-proof operation. It is powered by means of a 4-pin connector, ensuring up to 83.12 CFM airflow at 26 dB noise. Besides, at the highest rotational speed the …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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Registered at: 13 December 2011, 09:21
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