Antec Outs Budgetary GX500 Chassis

Antec, a well-known designer of multiple hardware solutions, has released a new budgetary chassis, codenamed GX500. The model is developed in mid-tower form-factor and features 205x476x458 mm dimensions. It is made of solid steel but is complemented by plastic patches. The case has got a totally black coating and minimum accessories. The customers are able to acquire the product for the recommended price tag of EUR 59.



Antec GX500 supports the integration of standard ATX, as well as detracted mini-ITX and micro-ATX motherboards. The internal layout is ready to accommodate two 5.25-inch drives, five 2.5/3.5-inch drives, and seven PCI expansion cards. Storage might be enlarged due to the availability of one more external 3.5-inch drive bay.


Spacing within the chassis is sufficient to pack ATX power supply unit, CPU cooler of 158 mm in height, graphics adapters of 380 mm in length, and heatspreaders (liquid-cooling) of 380 mm in length. The chassis’ exterior does not …

Next year TSMC will start manufacturing the first 20nm chips

The Taiwanese company TSMC confirmed its intention to start production of chips using 20 nm technological processes in 2013. However, for now the company does not plan its production on an industrial scale and will release the first chips in a limited quantities, giving them a total of 1% of production capacity. According to the head of the company, the mass production of semiconductor chips with this technology will not begin until 2014.



Meanwhile TSMC Company is going to produce only one version of the chip, which will be able to enter into the wide range of devices, from smart phones with low-power to high-performance graphics cards. For comparison, the Taiwanese company currently has four different output chips on 28-nm technology. These are 28LP (poly / SiON) for low-power low-cost chips, 28HPL (HKMG) for use in low power applications, 28HP (HKMG) for high-performance chips and 28HPM (HKMG). The latest version combines elements of high-performance chips with high efficiency …

Meet New High-Speed External Hard Drive Buffalo HD-GDU3

Buffalo Technology, a Japanese manufacturer of all innovatory storage devices and network solutions, showcases a new external hard drive, codenamed HD-GDU3, within the boundaries of DriveStation series. The new drive is housed in a black casing, featuring 45x126x202 mm dimensions. The model is known to have three capacity variations and, correspondingly, three different models: HD-GD1.0U3 (1TB), HD-GD2.0U3 (2TB) and HD-GD3.0U3 (3TB).



These external drives employ 3.5-inch hard drives as the basis and support an advanced high-speed USB 3.0 interface. Their layout involves 1GB of DRAM cache-memory which utilizes a dedicated caching software applet Turbo PC EX2, delivered along with the drives. This applet is called to immensely accelerate the data transfer process. The nominal delivery kit also includes a large software package with encoding and backup programs.


According to Buffalo developers, their HD-GDU3 is the fastest external hard drive ever seen. Thus, the maximal …
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