Company LEPA produces new power supplies B-series

LEPA introduced three new power supplies — B650-SA, B700-MAS and the B800-MAS, which will replace older models B750-MA, and B850-MA. Newcomers have been certified with 80 Plus Bronze (efficiency of 88% of the networks 230V), and met the standards of ATX12V v2.3 and EPS12V 2.92, and positioned as solutions for gamers and owners of GPU configurations SLI and CrossFire, workstations and small servers.

New items are equipped with inverter DC-DC (to improve stability), have the topology of Double Forward Circuit, as well as high-quality electrical components: solid capacitors and heat resistant (105 ° C) capacitors made in Japan.

Active cooling LEPA B700-MAS/B800-MAS is provided by 140-mm fan on double bearings. The model B650-SA has a fan size of 120 mm. The intensity depends on the rates of temperature sensor. Power Cables PCI-E, SATA and Molex flat are detachable. The main ATX 24-pin, as well as “CPU” EPS12V 8-pin are collected in a nylon sheath. LEPA B650-SA has …

A Pair of New Graphics Cards Radeon HD 7950 Boost Edition from MSI

MSI has replenished its series of Radeon HD 7950 graphics cards with a pair of new Boost Edition models. Codenamed R7950-3GD5 BE and R7950-3GD5/OC BE, both adapters feature practically identical to the first two releases (of the very series) design. Nonetheless, the novels are known to support AMD ZeroCore with Boost technology that provides for an automatic GPU clock frequency boost on conditions of an increased computing loading. Dynamic clock frequency indices of both models are not so dramatic, since they exceed the nominal showings at 10 MHz only; still, the support of a brand MSI Afterburner utility enables a raise of frequencies to the required level.

The two representatives of MSI Radeon HD 7950 Boost Edition series employ GDDR5 memory with an overall capacity of 3 GB and 384-bit interface. Its nominal clock frequency equals to 1250 MHz, while its efficient frequency achieves 5000 MHz. Memory modules, as well other critical components, are cooled down by a two-slot …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …
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Registered at: 23 July 2011, 18:43
Last visit: 23 July 2011, 18:44