Adata Introduces New Premier-Pro SP310 Solid-State Drives Series

Adata has recently introduced a new series of solid-state drives, entitled Premier-Pro SP310. The series consists of 32 GB, 64 GB and 128 GB models that are developed in mSATA form-factor. The drives feature 50.95x30x4 mm dimensions and are intended to be used as a speedy cache-memory or boot partition in OS for desktop and mobile devices.



Premier-Pro SP310 SSDs employ SATA 6 Gb/sec interface and are based on JMicron JFM-667 controller. The latter ensures that the drives could achieve the highest performance with the outstanding data transfer speeds. Therefore, the maximal sequential Read speed makes up 410 MB/sec, whereas the maximal sequential Write speed – 180 MB/sec. In its turn, the maximal random Read/Write speed reaches up 45.000 IOPS. Such showings are able to guarantee a substantial increase in system response speed.


To continue, the new-comers from Adata support all updated technologies, including NCQ, TRIM and S.M.A.R.T. They enhance the possibilities of the …

Asus A88X-Pro Motherboard Review: Ahead of Its Time

The elaboration of completely new APUs, codenamed Kaveri, compelled AMD work up one more suitable CPU socket – FM2+. Once after its launch, the leading manufacturers of motherboards have reacted on-the-fly, releasing proprietary models for a new platform. Asus, as usual, was among the first to introduce fresh solutions. Motherboard A88X-Pro is remarkable by the support of upcoming APUs, though it will be still possible to incorporate hybrid processors of the current generation for Socket FM2. For sure, this is not a mere advantage of the board. Let’s have a look at some other specs.



Key Peculiarities


Asus A88X-Pro is developed on AMD A88X chipset and houses an onboard Radeon HD 7000/8000 series graphics. The PCB allots 4 DIMM slots for DDR3 SDRAM modules. An overall capacity of modules set might achieve 64 GB, whereas an ultimate supported clock frequency makes up 2400 MHz. Expansion section is not as bright as a demanding customer would desire; nonetheless, it …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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