The Tempered Glass Edition of the Thermaltake Core X71 Chassis

The Thermaltake Company has announced a new Core X71 version of chassis. This solution is called Tempered Glass Edition and is produced in black colour.



One of the novelty’s panels possesses a window out of 4 mm tempered glass instead of the formerly used acrylic panel.


Due to its dual-chamber structure the chassis has much of the inner space, which allows to assemble a PC of almost any complexity with the liquid cooling system utilization.

Motherboards of Mini ITX, Micro ATX and ATX typical sizes can be installed. The maximum number of expansion cards is eight. One can use discrete graphics accelerators of up to 420 mm length.


In the front part of this product, there is enough room to mount a 480 mm heatsink, and it’s possible to install a 360 mm heat dissipator at the top. The preassembled power supply unit length equals to 220 mm.


The dimensions of this full tower chassis by Thermaltake are the following: 677 × 250 × 511 mm.


Unfortunately, the …

Akasa Prepares Its Euler for Upcoming Release

Recent global IT exhibition Computex 2012 has given promising prospects for Akasa company that introduced its new brand chassis. Codenamed Euler, this chassis might serve the basis for the noiseless mini-PCs. Due to the implementation of aluminum casing in design and its simultaneous substitute of a radiator, this device is able to function along with passive cooling system.



Akasa representatives have provided the Internet community with the first shots of Euler. Those pictures demonstrate that the future product will consist of a block which will remove the excessive heat from the CPU and its surrounding components. The model will support devices which show up to 35W TDP index. This chassis will be compatible with motherboards of mini-ATX form-factor and low-capacity two-core processors.


According to the words of the company's representatives, Euler is going to be released this September. The price policy has not been voiced so far, but hardware specialists are certain …

The new version of the chassis from Zalman Z9 Plus

The company Zalman continues to utilize the design of the whole successful chassis Z9, releasing a new model Z9 Plus D4-U3. Perhaps, the only difference from the recent Z9 U3 is the lower part of the front panel, made in the form of letter D.



The list of applied characteristics has remained the same. The body is made of steel and plastic in the form factor Mid-Tower. Its dimensions are 504 (L) x 207 (W) x 464 (H) mm, weight — a little over 7 lbs. Inside can be placed the motherboard ATX or microATX, seven cards PCI-E expansion up to 290 mm, ATX-compatible power supply, three optical drives, and seven hard drives, including two SSD 2.5 format.


The set includes two 120-mm fan — in front with the LED-backlit display and on the back without it. On the input-output is a small information display, two USB 3.0 ports and USB 2.0, Mini-Jack connectors for headphones and microphone.


Zalman Z9 Plus D4-U3 will debut in Japan and perhaps in some other markets, August 19 at a …
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Registered at: 13 November 2011, 21:32
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