Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …

NEC launches ultrabook based on Core i7 weighting 875g

Japanese company NEC has prepared a unique laptop VersaPro UltraLite VG for state market of the rising sun. The use of light materials and advanced components has reduced the weight of a 13.3-inch laptop up to 875g total.

The body of ultrabook is made of magnesium-lithium alloy and has thickness of 14.9 mm. The product is designed for business travelers who need high performance in small form factor. The «heart» of the laptop is dual-core Core i7-3517U (Ivy Bridge), operating at a frequency of 1.9 GHz to 3 GHz, depending on the load. To it was joined by 4 GB of RAM SO-DIMM DDR3 and a 128-gigabyte SSD-drive. Built-in Intel HD graphics 4000 (350/1100 MHz) will provide an opportunity to play casual games on the screen with a resolution of 1600x900 pixels and LED-backlit display. Windows 7 Professional OS is installed on this ultrabook.

It is worth mentioning about the presence of USB 3.0 ports and HDMI, network interfaces Wi-Fi and Bluetooth, card reader, HD webcam and …

Biostar Introduces a New Hi-Fi B85S3+ Motherboard for Audiophiles

Biostar is glad to introduce one more representative of Hi-Fi Series of motherboards – the Hi-Fi B85S3+. The model is developed in micro-ATX form-factor and is intended for budget-oriented audiophiles. The heart of the board is Intel B85 Express chipset that shows compatibility with Intel Core i3/i5/i7 CPUs (4th generation) for Socket LGA1150 with the TDP level of not more than 95W. Due to a rather compact design, the new-comer is an ideal solution for small-sized home PCs and multi-media centers.

The Hi-Fi B85S3+ takes use of 4-phase power supply subsystem. It employs high-quality capacitors with a solid electrolyte and chokes with shell-type mandrels. Memory consists of four slots for DDR3 modules (running at 1600 MHz) with the overall capacity of 32 GB. Expansion is provided by one PCI slot, two PCI Express 2.0 x1 slots and one PCI Express 3.0 x16 slot.

Storage facilities are ensured by means of two SATA II ports and four SATA III ports. Network gigabit Ethernet port …
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Registered at: 26 May 2012, 11:18
Last visit: 26 May 2012, 14:30