The Cube-Shaped Desktop PC DB4 Fanless Silent SL by Orio Spec

DB4 Fanless Silent SL is a desktop PC in the form of the cube by Orio Spec. It possesses STREACOM’s mini-ITX case “DB4” without fans. Besides, this desktop PC makes no noise and is produced with a 3.20 GHz Intel Core i3-6100T dual-core CPU.



DB4 Fanless Silent SL’s mother board features an Intel HD video adapter (with one HDMI, one VGA and one DVI-D ports) and an Intel H110 Express chip set. The cube-shaped desktop PC is also configured with a 8 GB PC4-17000 DDR4 RAM (4 GBx2), a 120 GB SSD (Samsung 750 EVO), four USB 2.0 connectors, two USB 3.0 connectors and one Gigabit LAN (RJ45) port.


Speaking about operating systems one should admit, that the DB4 Fanless Silent SL is compatible with Windows 10 Home 64-bit or Windows 10 Pro 64-bit, which is optional.

This model is now estimated to cost approximately $1,084 or 120,000 Yen.

Spire Showcases New Cylinder-Shaped Swirl IV CPU Cooler

Spire is going to release a new extraordinary cooling solution: a cylinder-shaped CPU cooler, entitled Swirl IV. It is targeting Intel processors for Socket 2011/1366/115x/775 and AMD FM1/FM2/AM2/AM3 platforms with the maximum TDP level of 130 W. The new-comer has received RoHS and CE certification that proves its environmentally-friendly nature. An official release is postponed to January 2015.



Spire Swirl IV features 131x125x62 mm dimensions and weighs 690 g. Its heatsink consists of 45 aluminum fins, pierced by three copper zinc-plated U-shaped heatpipes (8 mm). Inside the heatsink one can find a 60 mm fan with blue LED backlit. Its rotational speed is controlled by PWM technology so that the blades could run between 600 RPM up to 2000 RPM.


The fan is equipped with a slide bearing, estimated for 50.000 hours of fool-proof operation. It is powered by means of a 4-pin connector, ensuring up to 83.12 CFM airflow at 26 dB noise. Besides, at the highest rotational speed the …

Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.



In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.


Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …
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Registered at: 18 March 2011, 16:16
Last visit: 18 March 2011, 16:16