Processors Intel Haswell to Rival Accelerator NVIDIA Tesla

Intel Corporation has the intentions to introduce DDR4 memory into their server processors of Haswell series. The launch of such technological approach is planned for the 2014, however the developments in this sphere have already started. Intel’s server solutions will become a part of Grantley platform and the samples of their new series will allegedly be announced next autumn. The preview of new processors makes it clear that some of the chips will be distinguished by the increased heat generation performance which will reach 160 W.

Hence, 16-core processors Haswell-EP will rival parallel computing accelerator NVIDIA Tesla but not AMD server solutions. Intel is going to provide various working frequency options and options with different number of active cores. At the same time, TDP will fluctuate within ranges of 160, 145, 135, and 120 W. In its turn, accelerator NVIDIA Tesla, which is based on GK110 processor, consumes approximately 300 W.

In accordance with the …

Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.

In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.

Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …

Top-Tier Chassis Zalman H1 Review

Zalman has long been deprived of a full-tower flagship PC chassis, after it discontinued the line of GS1200. The anticipation of a new etalon was accompanied by an overall market uncertainty as for the future of desktop platforms. Luckily, laptops and tablets couldn’t fully satisfy the customers’ growing needs, so Zalman decided to fire off with a new top-tier case, entitled H1. Stylish and magnetic from outside, this model has a lot of interesting options in the bins. Let’s have a look at them.

Key Features

Zalman H1 is a full-tower case, featuring 561x238x570 mm dimensions. The chassis is made of steel, aluminum and a high-quality plastic, with exterior and interior totally painted black. Internal layout allows for the installation of motherboards with elongated PCBs, including E-ATX and XL-ATX models. The model houses three external bays for 5.25-inch drives, seven internal bays for 2.5-/3.5-inch drives as well as nine expansion slots.

The case boasts some …
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Registered at: 06 June 2012, 05:55
Last visit: 06 June 2012, 05:55