Scythe to Release a General-Duty Grand Kama Cross 3 CPU Cooler

Scythe, a well-known Japanese designer of top-notch PC cases & cooling systems, announces the release in the European market of its general-duty CPU cooler, entitled Grand Kama Cross 3 (codename: SCGKC-3000). The greenhorn features 171x147x140 mm dimensions and weighs 790 g. It is compatible with an overwhelming majority of Intel and AMD platforms (except for AM1). Pricing is set at 40 EUR.



Scythe Grand Kama Cross 3 consists of a two-section aluminum heatsink that includes multi-form ribs, a copper base, four copper heatpipes, and a 140-mm fan GlideStream. The latter supports PWM technology which allows the blades to rotate within 400 RPM and 1300 RPM range. On low revolutions the airflow reaches 50.8 CFM, while on the peak rotational index the airflow achieves 165.1 CFM index. Despite high efficiency, the noise level remains on a comfortable level: 12.5-30.7 dB.


This cooler is additionally furnished with a dedicated Hyper Precision Mounting System. It employs screws …

Overview of the MSI B250M Mortar Motherboard

January of 2017 was marked by the emergence of new processors Intel Kaby Lake-S, while the motherboard manufacturers have released products based on fresh 200- series chipsets. The PCH execution identity allows vendors to produce different models based on the earlier designed PCB. MSI B250M Mortar is one of the kind, as the manufacturer has a similar model – MSI Z270M Mortar.


Technical Characteristics



In fact, B250 is the youngest of the latest generation products. The most significant of its innovations is supporting the work of drives with PCI-E interface, mainly implemented in the popular now format M.2. The model is equipped with an expansion slot of this type. Additional adapters are unavailable, so all the possibilities come through Intel B250. The network interface uses the Intel controller, and the sound is formed by Realtek ALC892.


The B250M’s characteristics are as follows:


• Chipset – Intel B250 • Processor socket – Socket 1151 • …

Cooler Master to Continue Its Series of Heatsinks with Vapor Chambers

Cooler Master has lately introduced its new lineup of coolers with the implementation of vapor chambers technology (TPC 812 series). However, the company's plans are not limited to this series only, and the upcoming release of V4 GT series is the most convincing proof of it. The new series will be based on horizontal vapor chamber technology and intended at the colling down of high-end graphics cards.



In accordance with the manufacturer's undertakings and plans, the implementation of this technology will provide for the octuple improvement of heat dispersion as compared with the solid copper-contact sink. This approach towards the processor's colling down enables the involvement of more heat pipes. Nevertheless, V4 GT model will be equipped with only four heat pipes.


Vapor chamber technology stipulates efficient removal of heat from the processor and other integral components. At the same time, it averts the creation of hot spots and promotes for the even distribution of …
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Registered at: 08 August 2012, 09:21
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