ViewSonic Outs XG03 Gaming Monitors

ViewSonic has enlarged its lineup of gaming products with another series of monitors – the XG03. The lineup currently consists of two models: XG2703 & XG2703-GS. The key differentiation between them lies in the support for AMD FreeSync (the first model) and Nvidia G-Sync (the second model). Consequently, the GX2703 employs red accents in design, whereas the XG2703-GS uses green detailing.



ViewSonic XG03 is based on 27-inch SuperClear IPS panel, featuring 2560x1440 pixels & 165 Hz refresh rate. The display boasts 16:9 aspect ratio, 178/178 degrees viewing angles, 1000:1 static contrast, 120M:1 dynamic contrast, 300 cd/m2 maximal brightness as well as 4 ms response time.


The abovementioned parameters refer to the XG2703-GS model that is already on sale (estimated price — $699.99). The other model will be released in the nearest future.


The models are thought to be equipped with a pair of 2-watt speakers, 100x100 mm VESA bracket, a couple of USB 3.0 ports, the same …

The Mid-Tower X2 Samurai Case from Spire Is ATX and MicroATX Motherboards Compatible

The X2 products range of the Dutch-Chinese Spire Company has been replenished by a new Mid-Tower Samurai chassis, which is ATX and MicroATX motherboards compatible.



X2 Samurai is produced out of 0.5 mm SPCC steel and is capable to hold seven 1-slot expansion cards, an АТХ-compatible power unit, two 3.5” and a pair of 2.5” drives, as well as two devices of the 5,25” format. This novelty allows to install up to five 120 mm fans.


The PC case is designed in two versions: with a fully acrylic and with a perforated side panel, providing a prospect for installing 2 extra 120 mm fans. Please, note, that the X2 Samurai supply kit doesn’t include illuminated fans, which, however, add showiness to outer appearance. The I/O panel features one USB 2.0, two USB 3.0 ports, a universal card-reader slot and a couple of Mini-Jack.


The Mid-Tower X2 Samurai Case weighs around 4.4 kg and possesses the following dimensions: 445 х 200 х 455 mm. It is already delivered to …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …
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