Toshiba will increase the capacity of hard drives up to 600 terabytes

Toshiba is engaged in improving the existing hard drives in order to increase their capacity. Limited to several tens of terabytes, Japanese do not want to stop — they need at least 600 terabytes in a single 3.5-inch drive. To do this, Toshiba uses all the tools and opportunities, including temporary cooperation with companies, competitors, TDK, and Showa Denko KK.

The newly formed trio of producers focuses on the development of new technologies of recording information on magnetic media and improvement of existing methods. Alliance sees great prospective in the technology of the so-called «two-dimensional magnetic recording» (TDMR). It is experimental, but using, it is quite achievable to record density of 10 terabits per square inch, which thus gives the capacity of 600 terabytes in a single hard drive.

Of course, no one talks about the chances of such a capacious storage in the foreseeable future — Toshiba and its partners will have more than one year of research …

Corsair to Release Hydro Series H5 SF Liquid Cooler

Taking into account the increasing number of cases when it’s impossible to install highly efficient air coolers on mini-ITX motherboards, Corsair has developed a universal low-profile liquid cooler. Entitled Hydro Series H5 SF, the unit shows compatibility with the majority of small-sized platforms for Intel LGA1366/115x and AMD FM1/FM2/AM2/AM3 sockets. Besides, this model is able to manage with up to 150 W of thermal power.

Corsair Hydro Series H5 SF is distinguished by an unusual framework. It employs dedicated props which hover the heatsink over the motherboard; thus, the system does not require additional space within the case. The base is made of polished copper.

The aluminum heatsink (167x40x57) is accompanied by a 120-mm fan that drags out hot air from heat-generating components. Its rotation speed varies from 1000 RPM to 1800 RPM, producing 12-24 CFM airflow. Still, the fan appears to be rather noisy with the peak levels of 36-42 dB.

Corsair bundles the …

Zalman Introduces Highly Efficient FX70 Passive Cooler

Zalman, a renowned South Korean designer of various hardware solutions, has recently introduced its latest CPU passive cooler, entitled FX70. The new-entry features 110x140x158 mm dimensions and comes without any fans. However, if there is a need to cool down CPUs with the TDP level higher than 80 W, the customer is free to enhance the facilities by adding two 120 mm fans. The latter are fixed to the heatsink by means of four brackets.

Zalman FX70 is an optimal choice for the following platforms: Intel LGA 2011/1366/115x/775 and AMD FM2/FM1/AM2/AM2+/AM3/AM3+. This cooler fits in any mid-tower ATX and larger PC chassis. The cooler’s framework consists of a copper base, pierced by six nickel-plated heatpipes, and of fifteen heatsink plates with an offbeat design, codenamed Twist; they are called to dramatically improve the process of heat management.

Fanless framework is regarded to be an advantage due to three reasons. First of all, pure heatsink provides absolutely no …
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