OCZ Announces a New Vertex 460 SSD Series

OCZ Storage Solutions, a newbie integral part of Toshiba Group Company, announces the release of a new SSD series, entitled Vertex 460. The series is represented by three 2.5-inch models of 480 GB, 240 GB, and 120 GB capacity. In order to facilitate with the installation and further utilization, the manufacturer equips all drives with a dedicated 3.5-inch adapter, as well as with Acronis True Image HD software package. Moreover, the models are backed by 3-years limited warranty that guarantees durable reliability.

OCZ Vertex 460 drives are based on Toshiba NAND MLC flash chips, elaborated according to 19 nm technological process. All three models employ SATA III 6 Gb/sec interface and are equipped with OCZ Barefoot 3 M10 controller. Thanks to such fusion, these SSDs demonstrate unprecedented performance results, whatever type of data is concerned.

Therefore, an ultimate data Read/Write speed in sequential operations equals to 545/525 MB/sec, whereas in 4 KB random …

ASUS is releasing ROG Vulcan PRO headphones for gamers

ASUS is preparing to release new gaming headphones by Republic Of Gamers family with codename ASUS ROG Vulcan PRO. They are the successor to the Vulcan ANC, which received great popularity with players around the world.

The main difference of new headphones is the availability of sound processor ROG Spitfire, which does not require installing any additional software — everything functions at the hardware level. It allows you to optimize performance sound by activating one of the three modes using special keys:

FPS EQ — designed for fans of the genre of FPS and allows players to hear important game details to better determine the position of the enemy;

7.1 virtual surround — provides emulation playback volume 8-channel sound;

Headphone amplifier — allows increasing the volume of the sounds.

High quality sound is provided by two 40-mm neodymium speaker. In addition, the headphones are equipped with built-in equalizer, thanks to which the user can configure the …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …
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Registered at: 09 September 2011, 19:49
Last visit: 09 September 2011, 19:49