Asus VivoPC K20 Strikes by Size-to-Performance Ratio

Asus has recently introduced another desktop PC model, entitled VivoPC K20. The new-comer is characterized by small-sized dimensions (381x279x96 mm, capacity — 10 liters) and stylish bodywork. It takes little space on the table and might be placed as in vertical so in horizontal aspects. The customers will be surprised to see a keyboard and a mouse in the nominal delivery set.

Asus VivoPC K20 supports the installation of motherboards based on Intel H110 chipset with Socket LGA1151 CPUs (Pentium, Celeron, Core i3/i5/i7). The CPU comes with an integrated Intel HD Graphics core; however, it’s possible to add a self-dependent graphics card. The PCB allows for the installation of up to 16 GB of DDR4-2133 MHz memory.

Storage subsystem offers space for HDDs of up to 3 TB capacity. The connection of other storage solutions is realized via a pair of SATA 6 Gb/sec ports. Expansion facilities are due to one PCIe 3.0 x16 and one mini-PCIe slots.

The CPU is cooled down by an …

Welcome In New LPDDR4 Memory Chips from Samsung

Samsung settles down to a large-scale production of LPDDR4 mobile memory chips. Elaborated according to 20 nm technological norms, the new-comers boast the integration of an advanced technology that ensures 8 Gb crystal density and twice the performance compared with LPDDR3 chips. Currently, the company produces models of 2 GB and 3 GB capacity, however in early 2015 it will set to the development of 4 GB solutions.

New LPDDR4 memory modules are targeting various mobile devices with thirst for lightning-fast data transfer speed. The latter index might accelerate up to 3200 Mb/sec; this will allow employing chips for the implementation of resource-intensive tasks, such as recording and playback of high-resolution video or serial filming.

Samsung developers claim that 2 GB LPDDR4 DRAM is 40% more power-efficient than counterparts with 4 Gb crystal density. This became possible due to the adopting of low-voltage swing-terminated logic for I/O signaling. As a result, the …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …
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Registered at: 21 May 2012, 23:23
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