First SSDs from Asus to be Released Already in May

First seen at CES 2013 exhibition, Asus ROG RAIDR solid-state drives are on their final stage of development before an official release in May. Unlike the majority of contemporary SSD solutions in the market, the product from Asus features quite distinct form-factor, similar to expansion cards. The new drive is known to employ PCI Express 2.0 x2 interface with the support of x16/x8/x4 slots.



According to the preliminary data, ROG RAIDR solid-state drives will be available in two capacity variations – 120 GB and 240 GB. Both models will run under a couple of SandForce SF2281 controllers, comprised into RAID 0 array. MLC NAND flash-memory chips from Toshiba (designed under 19 nm technological process) will be the heart of revolutionary SSDs. Irrespective of the overall differentiation, ROG RAIDR will support a range of technologies traditional SSDs support, including S.M.A.R.T., TRIM and NCQ.


With the respect to the performance, both drives will be able to demonstrate …

New Gigabyte Radeon HD 7970 operates at a frequency of 1100 MHz

Gigabyte presented a new overclocking model of video card Tahiti XT, designated as GV-R797TO-3GD. In comparison to the current Radeon HD 7970 OC (GV-797OC-3GD), the newcomer has some advantages. In particular, it is known that the graphic adapter is based on the graphics chip Radeon HD 7970 GHz Edition that is selected. The clock frequency of the accelerator is increased from 1000/5500 MHz (core / memory) to the 1100/6000 MHz, comparing GV-797OC-3GD. Standard values, recall — 925 MHz GPU with chip and 5500 MHz with GDDR5 microchip.



Externally the video adapter has no changes: the PCB soldered 3 GB of memory, which combines with the GPU on a 384-bit brace. The number of stream processors is unchanged — 2048 units. The design of printed circuit board includes electrical components Ultra Durable VGA. High-effective WindForce 3X cooler consists of a copper base, a few copper heat pipes and three 80-mm fans.


Unlike its predecessor, Gigabyte GV-R797TO-3GD has a gold plated …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.



The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
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