Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.

With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.

The initial stage of this program …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.

The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …

SilverStone Announces Precision PS13 Chassis

SilverStone has added to its inventory a straightforward-styled mid-tower chassis. Entitled Precision PS13, the new-comer features 426x400x126 mm dimensions and weighs 3.36 kg. It is targeting micro-ATX/ATX motherboards with the maximum of 7 expansion slots. The all-black frontal panel houses a large fine-meshed grille that optimizes airflow within the case. Pricing is set at $41.25.

SilverStone Precision PS13 allows installing a pair of external 5.25-inch drives and one external 3.5-inch drive. Internal layout stipulates the installation of three more 3.5-/2.5-inch drives. Spacing is enough for quite long videocards (up to 348 mm), typical ATX PS/2 power supply units (up to 174 mm in length) and standard CPU coolers (up to 162 mm in height).

The model is available in two body variations: with (SST-PS13B-W) and without a side transparent window. Cooling is ensured by means of a single preinstalled 120-mm frontal fan. Additionally, it’s feasible to integrate five other …
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Registered at: 26 March 2011, 08:34
Last visit: 26 March 2011, 08:34