Three New PC Cases from Lian Li for mini-ITX Motherboards

Lian Li has recently introduced three new PC chassis compatible with the motherboards of mini-ITX standard. Codenamed PC-Q27, PC-Q28 and PC-Q30, these cases replenished the 'Q' series and are called to replace more out-dated predecessors. The first two models in the row replace the earlier launched PC-Q07 and PC-Q25, while PC-Q30 is only a prototype that substantially differs from from its companions.

All three models are distinguished by a quite new approach to the motherboard fixture. Hence, instead of traditional trays, Lian Li employs two rails that fix the board. What is more, the designer has implemented quite a different system of side panels mounting.

The first PC case, PC-Q27, features 200x321x240 mm dimensions and is estimated for the installation of a single 5.25-inch drive, two 3.5-inch bays that support the installation of drives of 2.5-inch form-factor. The integrated cooling system consists of a single frontal 120 mm fan.

The second model, PC-Q28, is …

Meet New Motherboard from Biostar: Hi-Fi Z87W

Biostar is ready to launch its newest motherboard that is notable for the support of Windows 8.1 OS platform and availability of Windows Hardware Quality Labs certificate. Entitled Biostar Hi-Fi Z87W, it features a standard ATX form-factor and is relied on Intel Z87 Express chipset. Thereby, the board is ready to accommodate LGA1150 Intel Core processors (Haswell architecture).

The motherboard houses four slots for the installation of DDR3 memory modules that run at the maximal 2600 MHz (up to 32 GB). Power subsystem is organized according to 8-phase scheme to provide enough power to the CPU and other key components. Expansion facilities are secured by means of two PCI slots, the same number of PCI-e 2.0 x1 slots, one PCI-e 2.0 x16, and one more PCI-e 3.0 x16 slot. Storage facilities are represented by six SATA III 6 Gb/sec ports, which can be combined into diverse RAID configurations.

Gigabit Ethernet port takes responsibility for network connectivity, while Power, Reset …

Intel Broadwell CPUs will Get BGA Casing

The Internet community is energetically discussing unofficial info concerning the future Intel's Broadwell processors. According to the yet unacknowledged data, Intel will branch off from currently traditional LGA casings in favor to a more advanced BGA solution. At present all CPUs designed by Intel specifically for desktop platforms feature LGA (Land Grid Array) casings which allow the users to upgrade their systems without any hassle. On LGA implementation, the chip is housed within a socket and contacts with the motherboard. As a result, the user might change one chip to the other only with similar set of contacts.

The launch of Intel Broadwell processors, which is planned for 2014, might dramatically change the situation for customers. Most probably Intel will refuse from LGA casings and accommodate all new CPUs in BGA ones, marking the change of Haswell generation to the future Broadwell generation developed under 14 nm technological process. BGA (Ball Grid Array) …
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Registered at: 11 January 2012, 14:57
Last visit: 15 January 2012, 23:29