Lian Li PC-B12 - Aluminum chassis for silence devotees

Lian Li engineers have decided to diversify the range of branded chassis with “quiet” PC-B12. This Mid-Tower model is designed in such a way as to minimize the noise coming from the system unit. To do this, the anterior wall of the chassis is made solid and in construction added the cover for the rear fan, included damping pad for hard drives and fans, as well as 'soft' feet, on which the hull stands.



Lian Li PC-B12 is currently available only in black version. Its dimensions are 498 (L) x 210 (W) x 472 (H) mm, weight — 6.4 kg. Inside can be placed the motherboard form factor ATX or microATX, a maximum of 8 cards PCI-E expansion up to 360 mm, the CPU cooler up to 160 mm, power supply, three hard disk format 3.5 «and one 2.5». The pair of «external» 5.25-inch bays should as well be considered.


New model doesn’t have vent on the front panel; it is migrated to the lower bound of the chassis and serves two 140 mm fan located opposite basket for storage. Blow-out …

Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …

Overview of the ASUS Prime Z270-A Motherboard

Today we’ll have a glance at one of the ASUS Prime series motherboards. The model having A- index has all the necessary basic features, when nothing has yet been simplified, the power subsystem seems to be good enough and there are no additional controllers of any sort.


Technical characteristics

We can see that the PCI, and SATA-E interfaces are already renounced, and the M.2 is increasing its presence. All the other main characteristics are listed below:


• Chipset – Intel Z270 • Processor socket – Socket 1151 • Processors – Core i7, Core i5, Core i3, Pentium, Celeron (Skylake-S, Kaby Lake-S) • Memory – 4 DIMM DDR4 SDRAM 2133/2400*/2666*/2800*/3000*/3200*/3300*/3333*/ 3400*/3466*/3600*/3733*/3866* (OC), a maximum of 64 GB • PCI-E Slots – 2 x PCI Express 3.0 x16 (x16 + x0, x8 + x8) 1 x PCI Express 3.0 x16 (x4)4 x PCI Express 3.0 x1 • M.2 – 1 x PCI Express 3.0 x4 (Key M, 2242/2260/2280/22110) 1 x PCI Express 3.0 x4 (Key M, 2242/2260/2280) • …
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Registered at: 17 May 2012, 21:36
Last visit: 22 May 2012, 19:40