New E2276VWM6 and E2476VWM6 Monitors from AOC are Showcased

Retina stress, triggered by a durable indigo emission, is no longer a threat for users, since AOC has integrated an innovative Anti-Blue Light technology into a pair of high-end monitors. The E2276VWM6 and E2476VWM6 boast an increased from 450 nm to 460 nm wavelength; this reduces harmful blue emissions by 90% and promotes for an ideal color rendering.



Moreover, a couple comes with an implemented Flicker Free technology. It totally eliminates flickering on adjusting LED backlight towards screen brightness. This provides for a better eye care.


To continue, both new-comers from AOC are known to support 1920x1080 resolution, 16:9 aspect ratio, 1000:1 static contrast, 20M:1 dynamic contrast, 170/160 degrees viewing angles, 2 ms response time (perfect for gaming and dynamic video applications), and 16.7 million of displayed colors. The connection of external devices is realized thanks to one VGA port and one HDMI with MHL support. The latter allows Android-based devices to …

The Tempered Glass Edition of the Thermaltake Core X71 Chassis

The Thermaltake Company has announced a new Core X71 version of chassis. This solution is called Tempered Glass Edition and is produced in black colour.



One of the novelty’s panels possesses a window out of 4 mm tempered glass instead of the formerly used acrylic panel.


Due to its dual-chamber structure the chassis has much of the inner space, which allows to assemble a PC of almost any complexity with the liquid cooling system utilization.

Motherboards of Mini ITX, Micro ATX and ATX typical sizes can be installed. The maximum number of expansion cards is eight. One can use discrete graphics accelerators of up to 420 mm length.


In the front part of this product, there is enough room to mount a 480 mm heatsink, and it’s possible to install a 360 mm heat dissipator at the top. The preassembled power supply unit length equals to 220 mm.


The dimensions of this full tower chassis by Thermaltake are the following: 677 × 250 × 511 mm.


Unfortunately, the …

Next year TSMC will start manufacturing the first 20nm chips

The Taiwanese company TSMC confirmed its intention to start production of chips using 20 nm technological processes in 2013. However, for now the company does not plan its production on an industrial scale and will release the first chips in a limited quantities, giving them a total of 1% of production capacity. According to the head of the company, the mass production of semiconductor chips with this technology will not begin until 2014.



Meanwhile TSMC Company is going to produce only one version of the chip, which will be able to enter into the wide range of devices, from smart phones with low-power to high-performance graphics cards. For comparison, the Taiwanese company currently has four different output chips on 28-nm technology. These are 28LP (poly / SiON) for low-power low-cost chips, 28HPL (HKMG) for use in low power applications, 28HP (HKMG) for high-performance chips and 28HPM (HKMG). The latest version combines elements of high-performance chips with high efficiency …
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